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WA02A Datasheet(PDF) 6 Page - WALSIN TECHNOLOGY CORPORATION |
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WA02A Datasheet(HTML) 6 Page - WALSIN TECHNOLOGY CORPORATION |
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6 / 7 page ![]() Approval sheet Page 6 of 7 ASC_WA02A_V02 Jan - 2013 TEST AND REQUIREMENTS Essentially all tests are carried out according to the schedule of IEC publication 115-8, category LCT/UCT/56(rated temperature range : Lower Category Temperature, Upper Category Temperature; damp heat, long term, 56 days). The testing also meets the requirements specified by EIA, EIAJ and JIS. The tests are carried out in accordance with IEC publication 68, "Recommended basic climatic and mechanical robustness testing procedure for electronic components" and under standard atmospheric conditions according to IEC 60068-1, subclause 5.3. Unless otherwise specified, the following value supplied : Temperature: 15°C to 35°C. Relative humidity: 45% to 75%. Air pressure: 86kPa to 106 kPa (860 mbar to 1060 mbar). All soldering tests are performed with midly activated flux. REQUIREMENT TEST PROCEDURE Resistor Jumper Electrical Characteristics JISC5201-1: 1998 Clause 4.8 - DC resistance values measurement - Temperature Coefficient of Resistance (T.C.R) Natural resistance change per change in degree centigrade. ( ) 6 1 2 1 1 2 10 × − − t t R R R (ppm/ °C) t1 : 20°C+5°C-1°C R1 : Resistance at reference temperature R2 : Resistance at test temperature Within the specified tolerance Refer to “QUICK REFERENCE DATA” N/a Short time overload (S.T.O.L) Clause 4.13 Permanent resistance change after a 5 seconds application of a voltage 2.5 times RCWV or the maximum overload voltage specified in the above list, whichever is less. ∆R/R max. ± (2%+0.10 Ω) < 50m Ω Resistance to soldering heat(R.S.H) Clause 4.18 Un-mounted chips completely immersed for 10±1second in a SAC solder bath at 260℃±5ºC ΔR/R max. ±(1%+0.05Ω) no visible damage < 50m Ω Solderability Clause 4.17 Un-mounted chips completely immersed for 2±0.5 second in a SAC solder bath at 235℃±5℃ good tinning (>95% covered) no visible damage Temperature cycling Clause 4.19 30 minutes at -55 °C±3°C, 2~3 minutes at 20°C+5°C-1°C, 30 minutes at +125 °C±3°C, 2~3 minutes at 20°C+5°C-1°C, total 5 continuous cycles ΔR/R max. ±(1%+0.05Ω) no visible damage < 50m Ω Load life (endurance) Clause 4.25 1000 +48/-0 hours, loaded with RCWV or Vmax in chamber controller 70±2ºC, 1.5 hours on and 0.5 hours off ΔR/R max. ±(3%+0.1Ω) no visible damage < 100m Ω Load life in Humidity Clause 4.24 1000 +48/-0 hours, loaded with RCWV or Vmax in humidity chamber controller at 40 °C±2°C and 90~95% relative humidity, 1.5hours on and 0.5 hours off ΔR/R max. ±(3%+0.1Ω) no visible damage < 50m Ω Adhesion Clause 4.32 Pressurizing force: 5N, Test time: 10±1sec. No remarkable damage or removal of the terminations. Bending strength JISC5201-1: 1998 Clause 4.33 Resistors mounted on a 90mm glass epoxy resin PCB(FR4), bending once 3mm for 10sec. ΔR/R max. ±(1%+0.05Ω) no visible damage < 50m Ω Insulation Resistance Clause 4.6 Apply the maximum overload voltage (DC) for 1minute R≧1GΩ Dielectric Withstand Voltage Clause 4.7 Apply the maximum overload voltage (AC) for 1 minute No breakdown or flashover |
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