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WA02A Datasheet(PDF) 6 Page - WALSIN TECHNOLOGY CORPORATION

Part # WA02A
Description  Higher component and equipment reliability
PDF  7 Pages
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Manufacturer  WALSIN [WALSIN TECHNOLOGY CORPORATION]
Direct Link  http://www.passivecomponent.com/
Logo WALSIN - WALSIN TECHNOLOGY CORPORATION

WA02A Datasheet(HTML) 6 Page - WALSIN TECHNOLOGY CORPORATION

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Approval sheet
Page 6 of 7
ASC_WA02A_V02
Jan - 2013
TEST AND REQUIREMENTS
Essentially all tests are carried out according to the schedule of IEC publication 115-8, category
LCT/UCT/56(rated temperature range : Lower Category Temperature, Upper Category Temperature; damp
heat, long term, 56 days). The testing also meets the requirements specified by EIA, EIAJ and JIS.
The tests are carried out in accordance with IEC publication 68, "Recommended basic climatic and mechanical
robustness testing procedure for electronic components" and under standard atmospheric conditions according
to IEC 60068-1, subclause 5.3. Unless otherwise specified, the following value supplied :
Temperature: 15°C to 35°C.
Relative humidity: 45% to 75%.
Air pressure: 86kPa to 106 kPa (860 mbar to 1060 mbar).
All soldering tests are performed with midly activated flux.
REQUIREMENT
TEST
PROCEDURE
Resistor
Jumper
Electrical
Characteristics
JISC5201-1: 1998
Clause 4.8
- DC resistance values measurement
- Temperature Coefficient of Resistance (T.C.R)
Natural resistance change per change in degree
centigrade.
(
)
6
1
2
1
1
2
10
×
−
−
t
t
R
R
R
(ppm/
°C) t1 : 20°C+5°C-1°C
R1 : Resistance at reference temperature
R2 : Resistance at test temperature
Within the specified
tolerance Refer to
“QUICK REFERENCE
DATA”
N/a
Short time overload
(S.T.O.L)
Clause 4.13
Permanent resistance change after a 5 seconds
application of a voltage 2.5 times RCWV or the
maximum overload voltage specified in the above
list, whichever is less.
∆R/R max.
±
(2%+0.10
Ω)
< 50m
Ω
Resistance to soldering
heat(R.S.H)
Clause 4.18
Un-mounted chips completely immersed for
10±1second in a SAC solder bath at 260℃±5ºC
ΔR/R max. ±(1%+0.05Ω)
no visible damage
< 50m
Ω
Solderability
Clause 4.17
Un-mounted chips completely immersed for
2±0.5 second in a SAC solder bath at 235℃±5℃
good tinning (>95% covered)
no visible damage
Temperature cycling
Clause 4.19
30 minutes at -55
°C±3°C, 2~3 minutes at
20°C+5°C-1°C, 30 minutes at +125
°C±3°C, 2~3
minutes at 20°C+5°C-1°C, total 5 continuous
cycles
ΔR/R max. ±(1%+0.05Ω)
no visible damage
< 50m
Ω
Load life (endurance)
Clause 4.25
1000 +48/-0 hours, loaded with RCWV or Vmax
in chamber controller 70±2ºC, 1.5 hours on and
0.5 hours off
ΔR/R max. ±(3%+0.1Ω)
no visible damage
< 100m
Ω
Load life in Humidity
Clause 4.24
1000 +48/-0 hours, loaded with RCWV or Vmax
in humidity chamber controller at 40
°C±2°C and
90~95% relative humidity, 1.5hours on and 0.5
hours off
ΔR/R max. ±(3%+0.1Ω)
no visible damage
< 50m
Ω
Adhesion
Clause 4.32
Pressurizing force: 5N, Test time: 10±1sec.
No remarkable damage or removal of
the terminations.
Bending strength
JISC5201-1: 1998
Clause 4.33
Resistors mounted on a 90mm glass epoxy resin
PCB(FR4), bending once 3mm for 10sec.
ΔR/R max. ±(1%+0.05Ω)
no visible damage
< 50m
Ω
Insulation Resistance
Clause 4.6
Apply the maximum overload voltage (DC) for
1minute
R≧1GΩ
Dielectric Withstand
Voltage
Clause 4.7
Apply the maximum overload voltage (AC) for 1
minute
No breakdown or flashover



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