Pad Assignment

Chip size: 2680

´ 2460 (mm)

2

Chip thickness=12 mil

* The IC substrate should be connected to VSS in the PCB layout artwork.

Pad Coordinates

Unit:

mm

Pad No.

X

Y

Pad No.

X

Y

1

-1012.997

1050.624

26

1095.853

-872.226

2

-1154.997

952.474

27

1095.853

-704.226

3

-1112.447

781.274

28

1095.853

-537.226

4

-1112.447

612.274

29

1128.153

-388.926

5

-1112.447

429.374

30

1113.753

-167.026

6

-1112.447

260.374

31

1094.353

63.524

7

-1112.447

77.474

32

1094.353

241.524

8

-1112.447

-91.526

33

1094.353

431.524

9

-1112.447

-274.426

34

1094.353

589.524

10

-1112.447

-443.426

35

1124.553

798.974

11

-1112.447

-626.326

36

1124.553

903.974

12

-1112.447

-795.326

37

1124.553

1008.974

13

-1112.447

-978.226

38

1019.553

1008.974

14

-820.147

-1019.426

39

914.553

1008.974

15

-674.147

-1019.426

40

809.553

1008.974

16

-526.147

-1019.426

41

704.553

1008.974

17

-380.147

-1019.426

42

599.553

1008.974

18

-232.147

-1019.426

43

494.553

1008.974

19

-86.147

-1019.426

44

389.553

1008.974

20

61.853

-1019.426

45

221.853

1016.974

21

216.853

-1018.926

46

74.453

1016.974

22

371.853

-1018.926

47

-71.247

1016.974

23

526.853

-1018.926

48

-226.247

1016.974

24

681.853

-1018.926

49

-487.887

1001.224

25

1095.853

-1039.226

HT6750A

Rev. 1.00

2

January 17, 2003

1

2 6

2

2 7

3

2 8

4

2 9

5

3 0

6

3 1

7

3 2

8

3 3

9

3 4

1 0

3 5

1 1

3 6

1 2

3 7

1 3

3 8

1 4

3 9

1 5

4 0

1 6

4 1

1 7

4 2

1 8

4 3

1 9

4 4

2 0

4 5

2 1

4 6

2 2

4 7

2 3

4 8

2 4

4 9

2 5

( 0 , 0 )

C O M 1

S E G 1

S E G 2

S E G 3

S E G 4

S E G 5

S E G 6

S E G 7

S E G 8

S E G 9

S E G 1 0

V S S

R E S E T

T E S T 1

O S C O

O S C I

V D D

V D D

V . 4

L C 2

L C 1

V . 2

R . 1

R . 2

R . 3