Philips Semiconductors

PMWD30UN

Dual

µTrenchMOS™ ultra low level FET

Product data

Rev. 01 — 22 January 2003

9 of 12

9397 750 10835

© Koninklijke Philips Electronics N.V. 2003. All rights reserved.

6.

Package outline

Fig 14. SOT530-1 (TSSOP8).

UNIT

A1

A

max.

A2

A3

bp

L

HE

Lp

wy

v

ce

θ

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

mm

0.15

0.05

0.95

0.85

0.30

0.19

0.20

0.13

3.10

2.90

4.50

4.30

0.65

6.50

6.30

0.70

0.35

8

°

0

°

0.10

0.10

0.10

0.94

DIMENSIONS (mm are the original dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

0.70

0.50

SOT530-1

MO-153

99-12-27

00-02-24

bp

D

Z

e

0.25

14

8

5

θ

A

A2

A1

Lp

(A3)

detail X

L

HE

E

c

X

A

y

2.5

5 mm

0

scale

TSSOP8: plastic thin shrink small outline package; 8 leads; body width 4.4 mm

SOT530-1

1.10

pin 1 index