HCPL-193K datasheet(5/12 Pages) HP

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Absolute Maximum Ratings

Storage Temperature ................................................. -65

°C to +150°C

Operating Temperature ............................................... -55

°C to +125°C

Lead Solder Temperature ................................................ 260

°C for 10 s

1.6 mm below seating plane

Forward Input Current – II (each channel) ................................. 60 mA2

Reverse Input Current ................................................................. 60 mA

Supply Voltage – VCC ....................................... 7 V (1 Minute Maximum)

Enable Input Voltage – VE (each channel) ...................................... 5.5 V

Not to exceed VCC by more than 500 mV

Output Collector Current – IO (each channel) ............................. 25 mA

Output Collector Power Dissipation (each channel) ................... 40 mW

Output Collector Voltage – VO (each channel) ................................... 7 V

Total Package Power Dissipation .............................................. 564 mW

Input Power Dissipation (each channel) ................................... 168 mW

Parameter

Symbol

Min.

Max.

Units

Input Current, Low Level

IIL

250

µA

Input Current, High Level*

IIH

12.5

Supply Voltage, Output

VCC

4.5

5.5

High Level Enable Voltage

VEH

2.0

VCC

Low Level Enable Voltage

VEL

0.8

Fan Out (@ RL = 4 kΩ)

TTL

Loads

Operating Temperature

-55

125

°C

*12.5 mA condition permits at least 20% guardband for optical coupling variation. Initial

switching threshold is 10 mA or less.

Recommended Operating Conditions

ESD Classification

(MIL-STD-883, Method 3015) .............................................. (

∆), Class 1

Schematic

A 0.1

µF BYPASS CAPACITOR

MUST BE CONNECTED BETWEEN

PINS 10 AND 15 (SEE NOTE 1).

HCPL-193K Datasheet(PDF) 5 Page - Agilent(Hewlett-Packard)

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