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RT8239B Datasheet(PDF) 20 Page - Richtek Technology Corporation |
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RT8239B Datasheet(HTML) 20 Page - Richtek Technology Corporation |
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20 / 24 page ![]() RT8239A/B/C 20 DS8239A/B/C-06 October 2012 www.richtek.com © Copyright 2012 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation. Output Over Voltage Protection (OVP) The output voltage can be continuously monitored for over voltage. If the output voltage exceeds 12% of its set voltage threshold, the over voltage protection is triggered and the LGATEx low side gate drivers are forced high. This activates the low side MOSFET switch, which rapidly discharges the output capacitor and pulls the input voltage downward. The RT8239A/B/C is latched once OVP is triggered and can only be released by either toggling ENLDO, ENTRIPx or cycling VIN. There is a 5 μs delay built into the over voltage protection circuit to prevent false transition. Note that latching LGATEx high will cause the output voltage to dip slightly negative due to previously stored energy in the LC tank circuit. For loads that cannot tolerate a negative voltage, place a power Schottky diode across the output to act as a reverse polarity clamp. If the over voltage condition is caused by a short in high side switch, turning the low side MOSFET on 100% will create an electrical short between the battery and GND, hence blowing the fuse and disconnecting the battery from the output. Output Under Voltage Protection (UVP) The output voltage can be continuously monitored for under voltage. If the output is less than 58% of its set voltage threshold, the under voltage protection will be triggered and then both UGATEx and LGATEx gate drivers will be forced low. The UVP is ignored for at least 5ms (typ.) after a start up or a rising edge on ENTRIPx. Toggle ENTRIPx or cycle VIN to reset the UVP fault latch and restart the controller. Thermal Protection The RT8239A/B/C features thermal shutdown to prevent damage from excessive heat dissipation. Thermal shutdown occurs when the die temperature exceeds 150 °C. All internal circuitry is inactive during thermal shutdown. The RT8239A/B/C triggers thermal shutdown if LDOx is not supplied from VOUTx, while input voltage on VIN and drawing current from LDOx are too high. Nevertheless, even if LDOx is supplied from VOUTx, overloading LDOx can cause large power dissipation on automatic switches, which may still result in thermal shutdown. Discharge Mode (Soft Discharge) When ENTRIPx is low and a transition to standby or shutdown mode occurs, or the output under voltage fault latch is set, the output discharge mode will be triggered. During discharge mode, an internal switch creates a path for discharging the output capacitors' residual charge to GND. Shutdown Mode SMPS1, SMPS2, LDO3 and LDO5 all have independent enabling control. Drive ENLDO, ENTRIP1 and ENTRIP2 below the precise input falling edge trip level to place the RT8239A/B/C in its low power shutdown state. The RT8239A/B/C consumes only 20 μA of input current while in shutdown. When shutdown mode is activated, the reference turns off. The accurate 0.95V falling edge threshold on ENLDO can be used to detect a specific analog voltage level and to shutdown the device. Once in shutdown, the 1.6V rising edge threshold activates, providing sufficient hysteresis for most applications. Power Up Sequencing and On/Off Controls (ENTRIPx, ENM) ENTRIP1 and ENTRIP2 control SMPS power up sequencing. When the RT8239A/B/C is applied in the single channel mode, ENTRIPx disables the respective output when ENTRIPx voltage rises above 4.5V. Furthermore, when the RT8239A is applied in the dual channel mode, the outputs are enabled when ENM voltage rises above 2.3V. |
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