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MPX4250AP Datasheet(PDF) 2 Page - NXP Semiconductors

Part # MPX4250AP
Description  20 to 250 kPa, Manifold absolute pressure sensor, on-chip signal conditioned, temperature compensated and calibrated
PDF  16 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

MPX4250AP Datasheet(HTML) 2 Page - NXP Semiconductors

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NXP Semiconductors
MPX4250A, MPXA4250A
20 to 250 kPa, Manifold absolute pressure sensor, on-chip signal conditioned, temperature
compensated and calibrated
MPx4250A
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2017. All rights reserved.
Data sheet: technical data
Rev. 8.0 — 25 July 2017
2 / 16
4 Ordering information
Table 1. Ordering information
# of Ports
Pressure type
Device name
Package
Options
Package
Name
None
Single
Dual
Gauge
Differential
Absolute
Device
marking
Small outline package (MPXA4250A series)
MPXA4250A6U
Rail
98ASB17756C
•
•
MPXA4250A
MPXA4250AC6U
Rail
98ASB17757C
•
•
MPXA4250A
MPXA4250AC6T1 Tape and Reel 98ASB17757C
•
•
MPXA4250A
Unibody package (MPX4250A series)
MPX4250A
Tray
98ASB42793B
•
•
MPX4250A
MPX4250AP
Tray
98ASB42796B
•
•
MPX4250A
5 Block diagram
Pins 4, 5 and 6 are NO CONNECTS
for unibody package devices.
Sensing
Element
V
OUT
V
CC
GND
Thin Film
Temperature
Compensation
and
Gain Stage #1
2 (Unibody)
2 (Small outline package)
4 (Small outline package)
Gain Stage #2
and Ground
Reference
Shift
Circuitry
1 (Unibody)
3 (Unibody)
3 (Small outline package)
Pins 1, 5, 6, 7, and 8 are NO CONNECTS
for small outline package devices.
Figure 2. Block diagram
6 Pinning information
6.1 Pinning
1
6
5
4
3
2
MPX4250A
(unibody)
MPXA4250A
(SOP)
GND
DNC
DNC
DNC
DNC
DNC
1
4
3
2
5
8
7
6
VCC
VOUT
Figure 3. Pinning diagram



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