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VSC7440 Datasheet(PDF) 434 Page - Microsemi Corporation |
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VSC7440 Datasheet(HTML) 434 Page - Microsemi Corporation |
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434 / 444 page ![]() Package Information VMDS-10492 VSC7440 Datasheet Revision 4.2 417 8 Package Information The VSC7440XMT package is a lead-free (Pb-free), 324-pin, plastic ball grid array (BGA) with a 19 mm × 19 mm body size, 1 mm pin pitch, and 1.8 mm maximum height. Lead-free products from Microsemi comply with the temperatures and profiles defined in the joint IPC and JEDEC standard IPC/JEDEC J-STD-020. For more information, see the IPC and JEDEC standard. This section provides the package drawing, thermal specifications, and moisture sensitivity rating for the VSC7440 device. 8.1 Package Drawing The following illustration shows the package drawing for the VSC7440 device. The drawing contains the top view, bottom view, side view, detail views, dimensions, tolerances, and notes. |
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