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VSC7440 Datasheet(PDF) 435 Page - Microsemi Corporation

Part # VSC7440
Description  L2/L3 Enterprise Gigabit Ethernet Switch with 10 Gbps Links
PDF  444 Pages
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Manufacturer  MICROSEMI [Microsemi Corporation]
Direct Link  http://www.microsemi.com
Logo MICROSEMI - Microsemi Corporation

VSC7440 Datasheet(HTML) 435 Page - Microsemi Corporation

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Package Information
VMDS-10492 VSC7440 Datasheet Revision 4.2
418
Figure 152 •
Package Drawing
8.2
Thermal Specifications
Thermal specifications for this device are based on the JEDEC JESD51 family of documents. These
documents are available on the JEDEC Web site at www.jedec.org. The thermal specifications are
modeled using a four-layer test board with two signal layers, a power plane, and a ground plane (2s2p
0.20 (4×)
X
Y
D
D1
E
e
E1
e
Ø b
Ø 0.10 M
Z
Ø 0.25 M
Z
X
Y
Pin A1 corner
Pin A1 corner
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
A1
A
2.
0.20 Z
Z
Seating plane
0.35 Z
Dimensions
Reference Minimum
Nominal
Maximum
D
E
D1
E1
e
A
A1
b
19.00 BSC
19.00 BSC
17.00 BSC
17.00 BSC
1.00 BSC
1.54
1.67
1.80
0.31
0.43
0.44
0.64
3.
Top View
Bottom View
Side View
Notes
1. All dimensions and tolerances are in millimeters (mm).
2. Primary datum Z and seating plane are defined by the
spherical crowns of the solder balls.
3. Dimension is measured at the maximum solder ball
diameter, parallel to primary datum Z.
4.
Radial true position is represented by typical values.



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