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VSC7440 Datasheet(PDF) 439 Page - Microsemi Corporation

Part # VSC7440
Description  L2/L3 Enterprise Gigabit Ethernet Switch with 10 Gbps Links
PDF  444 Pages
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Manufacturer  MICROSEMI [Microsemi Corporation]
Direct Link  http://www.microsemi.com
Logo MICROSEMI - Microsemi Corporation

VSC7440 Datasheet(HTML) 439 Page - Microsemi Corporation

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Design Guidelines
VMDS-10492 VSC7440 Datasheet Revision 4.2
422
•
When signals in a differential pair are mismatched, the result is a common-mode current. In a well-
designed system, common-mode currents should make up less than one percent of the total
differential currents. Mode currents represent a primary source of EMI emissions. To reduce
common-mode currents, route differential traces so that their lengths are the same. For example, a
5-mm (0.2-inch) length mismatch between differential signals having the rise and fall times of 200 ps
results in the common-mode current being up to 18% of the differential current.
Note: Care must be taken when choosing proper components (such as the termination resistors) in the
designing of the layout of a printed circuit board, because of the high application frequency. The use of
surface-mount components is highly recommended to minimize parasitic inductance and lead length of
the termination resistor.
Matching the impedance of the PCB traces, connectors, and balanced interconnect media is also highly
recommended. Impedance variations along the entire interconnect path must be minimized, because
they degrade the signal path and may cause reflections of the signal.
9.3.2
SerDes Interfaces (SGMII, 2.5G, 10G)
The SGMII interface consists of a Tx and Rx differential pair operating at 1250 Mbps. The 2.5G interface
consists of a Tx and Rx differential pair operating at 3125 Mbps. The 10G interface consists of a Tx and
Rx differential pair typically operating at 10.3125 Mbps.
The SerDes signals can be routed on any PCB trace layer with the following constraints:
•
Tx output signals in a pair should have matched electrical lengths. 10G pairs should match to <<
1mm.
•
Rx input signals in a pair should have matched electrical lengths. 10G pairs should match to <<
1mm.
•
SerDes Tx and Rx pairs must be routed as 100
Ω differential traces with ground plane as reference.
•
Keep differential pair traces on the same layer of the PCB to minimize impedance discontinuities. In
other words, avoid the use of vias wherever possible.
•
AC-coupling of Tx and Rx may be needed, depending on the attached PHY or module. External AC-
coupling is recommended for use with most PHYs. SFP and SFP+ modules have internal AC-
coupling, so they do not require additional AC-coupling capacitors. If AC-coupled, the VSC7440
SerDes inputs are self-biased. It is recommended to use small form factor capacitors, 0402 or
smaller, to reduce the impedance mismatch caused by the capacitor pads.
•
To reduce the crosstalk between pairs or other PCB lines, it is recommended that the spacing on
each side of the pair be larger than four times the track width. The characteristic impedance of the
pairs must predominantly be determined by the distance to the reference plane, and not the distance
to neighboring traces.
9.3.3
Serial Interface
If the serial CPU interface is not used, all input signals can be left floating.
The SI bus consists of the SI_CLK clock signal, the SI_DO and SI_DI data signals, and the SI_nCS0
device select signal.
When routing the SI_CLK signal, be sure to create clean edges. If the SI bus is connected to more than
one slave device, route it in a daisy-chain configuration with no stubs. Terminate the SI_CLK signal
properly to avoid reflections and double clocking.
If it is not possible (or desirable) to route the bus in a daisy-chain configuration, the SI_CLK signal should
be buffered and routed in a star topology from the buffers. Each buffered clock should be terminated at its
source.
9.3.4
PCI Express Interface
The VSC7440 device does not accept spread spectrum modulated PCIe input. Although the device only
supports PCI Express Base Specification Revision 1.1, the PCIe transmitter and receiver support the PCI
Express Base Specification Revision 2.0 Electrical sub-block specifications under the following
conditions:
•
Only 2.5 gigatransfers per second (GT/s) is supported.
•
Full swing output signaling is only supported when VDD_VS =1.2 V.



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