Epoxy Potting Compound/Adhesive

DP270 Clear and Black

- 6 -

Handling/Curing

Information (continued)

3. For maximum bond strength apply product evenly to both surfaces to be joined.

4. Application to the substrates should be made within 70 minutes. Larger quantities

and/or higher temperatures will reduce this working time.

5. Join the adhesive coated surfaces and allow to cure at 60°F (16°C) or above until

firm. Heat up to 200°F (93°C) will speed curing.

6. The following times and temperatures will result in a full cure of these products.

23°C (73°F)

48 Hours

50°C (122°F)

4 Hours

80°C (176°F)

60 Minutes

100°C (212°F)

30 Minutes

7. Keep parts from moving during cure. Contact pressure necessary. Maximum shear

strength is obtained with a 3-5 mil bond line.

8. Excess uncured adhesive can be cleaned up with ketone type solvents*.

*Note: When using solvents, extinguish all ignition sources, including pilot lights,

and follow the manufacturer’s precautions and directions for use.

Adhesion Coverage: A 0.005 in. thick bondline will yield a coverage of

320 sq. ft./gallon

Application and

Equipment Suggestions

These products may be applied by spatula, trowel or flow equipment.

Two part mixing/proportioning/dispensing equipment is available for intermittent or

production line use. These systems are ideal because of their variable shot size and

flow rate characteristics and are adaptable to most applications.