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LP3995 Datasheet(PDF) 5 Page - Lowpower Semiconductor inc

Part # LP3995
Description  200mA,Ultra-low Noise LDO Regulator
PDF  9 Pages
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Manufacturer  POWER [Lowpower Semiconductor inc]
Direct Link  http://www.lowpowersemi.com
Logo POWER - Lowpower Semiconductor inc

LP3995 Datasheet(HTML) 5 Page - Lowpower Semiconductor inc

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LP3995-02
Apr.-2017
Email: marketing@lowpowersemi.com
www.lowpowersemi.com
Page 5 of 9
Preliminary Datasheet
LP3995
Applications Information
L
ike any low-dropout regulator, the external capacitors
used with the LP3995 must be carefully selected for
regulator stability and performance. Using a capacitor
whose value is ≥ 10µF on the LP3995 input. The
input capacitor must be located a distance of not more
than 0.5 inch from the input pin of the IC and returned
to a clean analog ground. Any good quality ceramic or
tantalum can be used for this capacitor. The capacitor
with larger value and lower ESR (equivalent series
resistance) provides better PSRR and line-transient
response. The output capacitor must meet both
requirements for minimum amount of capacitance and
ESR in all LDO`s application. The LP3995 is designed
specifically to work with low ESR ceramic output
capacitor
in
space-saving
and
performance
consideration. Using a ceramic capacitor whose value
is at least 10µF with ESR is > 25mΩ on the LP3995
output ensures stability. The LP3995 still works well
with output capacitor of other types due to the wide
stable ESR range. Output capacitor of larger
capacitance can reduce noise and improve load
transient response, stability, and PSRR. The output
capacitor should be located not more than 0.5 inch
from the VOUT pin of the LP3995 and returned to a
clean analog ground.
Thermal Considerations
Thermal protection limits power dissipation in LP3995.
When the operation junction temperature exceeds
150°C, the OTP circuit starts the thermal shutdown
function turn the pass element off. The pass element
turns on again after the junction temperature cools by
30°C. For continue operation, do not exceed absolute
maximum operation junction temperature 125°C.
The power dissipation definition in device is:
PD = (VIN−VOUT) x IOUT + VIN x IQ
The maximum power dissipation depends on the
thermal resistance of IC package, PCB layout, the rate
of surroundings airflow and temperature difference
between junction and ambient.
The maximum power dissipation can be calculated by
following formula:
PD(MAX) = ( TJ(MAX) − TA ) /θJA
Where TJ(MAX) is the maximum operation junction
temperature 125°C, TA is the ambient temperature and
the θJA is the junction to ambient thermal resistance.
For recommended operating conditions specification
of LP3995, the junction to ambient thermal resistance
JA is layout dependent) for LP3995 showed below.
SOT23-3 : 250℃/W
SOT23-5 : 250℃/W
SOT89-3 : 180℃/W
TO92 : 180℃/W
And,
PD=(125°C−25°C)/250℃/W= 400mW (SOT23-3)
PD=(125°C−25°C)/250℃/W= 400mW (SOT23-5)
PD=(125°C−25°C)/165℃/W= 600mW (SOT89-3)
PD=(125°C−25°C)/180℃/W= 550mW (TO92)
The maximum power dissipation depends on
operating ambient temperature for fixed TJ(MAX) and
thermal resistance θJA.



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