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TXB0108 Datasheet(PDF) 2 Page - Texas Instruments |
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TXB0108 Datasheet(HTML) 2 Page - Texas Instruments |
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2 / 41 page ![]() Table of Contents 1 Features............................................................................1 2 Applications..................................................................... 1 3 Description.......................................................................1 4 Revision History.............................................................. 2 5 Pin Configuration and Functions...................................3 6 Specifications.................................................................. 5 6.1 Absolute Maximum Ratings........................................ 5 6.2 Handling Ratings.........................................................5 6.3 Recommended Operating Conditions.........................5 6.4 Thermal Information....................................................6 6.5 Electrical Characteristics.............................................6 6.6 Timing Requirements: VCCA = 1.2 V........................... 7 6.7 Timing Requirements: VCCA = 1.5 V ± 0.1 V...............7 6.8 Timing Requirements: VCCA = 1.8 V ± 0.15 V.............7 6.9 Timing Requirements: VCCA = 2.5 V ± 0.2 V...............7 6.10 Timing Requirements: VCCA = 3.3 V ± 0.3 V.............8 6.11 Switching Characteristics: VCCA = 1.2 V................... 8 6.12 Switching Characteristics: VCCA = 1.5 V ± 0.1 V.......8 6.13 Switching Characteristics: VCCA = 1.8 V ± 0.15 V.....9 6.14 Switching Characteristics: VCCA = 2.5 V ± 0.2 V.......9 6.15 Switching Characteristics: VCCA = 3.3 V ± 0.3 V.......9 6.16 Operating Characteristics....................................... 10 6.17 Typical Characteristics............................................ 11 7 Parameter Measurement Information.......................... 12 8 Detailed Description......................................................13 8.1 Overview................................................................... 13 8.2 Functional Block Diagram......................................... 13 8.3 Feature Description...................................................14 8.4 Device Functional Modes..........................................15 9 Application and Implementation.................................. 16 9.1 Application Information............................................. 16 9.2 Typical Application.................................................... 16 10 Power Supply Recommendations..............................18 11 Layout........................................................................... 18 11.1 Layout Guidelines................................................... 18 11.2 Layout Example...................................................... 18 12 Device and Documentation Support..........................19 12.1 Receiving Notification of Documentation Updates..19 12.2 Support Resources................................................. 19 12.3 Trademarks.............................................................19 12.4 Electrostatic Discharge Caution..............................19 12.5 Glossary..................................................................19 13 Mechanical, Packaging, and Orderable Information.................................................................... 19 13.1 Package Addendum................................................20 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision G (December 2018) to Revision H (August 2020) Page • Updated the numbering format for tables, figures and cross-references throughout the document...................1 • Added NME package option to Device Information table................................................................................... 1 • Added NME package to Figure 5-1 ................................................................................................................... 3 • Added NME package to Pin Assignments table................................................................................................. 4 • Added NME package to Thermal Information table............................................................................................6 Changes from Revision F (November 2014) to Revision G (December 2018) Page • Added pinout image for the ZYPR2 package option ..........................................................................................3 • Added text string 'GRID LOCATOR' to Pin Functions table YZP column to clarify pin location from 'Signal Name' .................................................................................................................................................................3 Changes from Revision E (April 2012) to Revision F (October 2014) Page • Added Pin Configuration and Functions section, Handling Rating table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section ............................................................................................................................................................... 1 • Changed VOLA value 0.9 to 0.3 ..........................................................................................................................6 Changes from Revision D (September 2011) to Revision E (April 2012) Page • Added notes to pin out graphics......................................................................................................................... 3 Changes from Revision C (August 2011) to Revision D (September 2011) Page • Added ±8-kV Human-Body Model (A114-B) (YZP Package Only) to Features.................................................. 1 TXB0108 SCES643H – NOVEMBER 2006 – REVISED AUGUST 2020 www.ti.com 2 Submit Document Feedback Copyright © 2020 Texas Instruments Incorporated |
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