6 Specifications

6.1 Absolute Maximum Ratings

see (1)

MIN

MAX

UNIT

Supply voltage

–0.5

7

V

Input voltage at any logic pin (D, MODE or F_SET)

–0.3

5.7

V

–18

18

V

Receiver output current

–24

24

mA

Junction temperature

170

°C

Storage temperature

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under Section 6.4 is not implied.

Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic

discharge

Human body model (HBM), per ANSI/ESDA/JEDEC

JS-001(1)

A and B pins to GND

±16,000

V

All pins

±4,000

Charged-device model (CDM), per JEDEC specification

JESD22-C101(2)

All pins

±1,500

(1)

JEDEC document JEP155 states that 500-V HBM allows safemanufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safemanufacturing with a standard ESD control process.

6.3 ESD Ratings - IEC Specifications

VALUE

UNIT

Electrostatic discharge

IEC 61000-4-2 ESD contact discharge, A and B pins to GND

±8

kV

IEC 61000-4-2 ESD air gap discharge, A and B pins to GND

±15

IEC 61000-4-4 electrical fast transient, A and B pins to GND

±4

6.4 Recommended Operating Conditions

MIN

NOM

MAX

UNIT

Supply voltage

3

5.5

V

Input differential voltage (A and B pins)

–7

12

V

Operational common mode voltage (A and B pins)

–7

12

V

High-level input voltage (D and MODE pins)

2

V

Low-level input voltage (D and MODE pins)

0

0.8

V

Output current

Driver

–60

60

mA

Receiver

–4

4

32

80

kΩ

ΔR

F_SET

Carrier frequency selection resistor tolerance

–2

2

%

Data rate

Modulation mode(1)

bps

100

pF

Operating ambient temperature

–40

125

°C

(1)

THVD8010

SLLSFK4 – NOVEMBER 2020

www.ti.com

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