7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1) (2) (3)

MIN

MAX

UNIT

Supply voltage

38

V

–0.5

38

V

–38

0.5

V

Logic control input pin voltage (SELx)(4)

–0.5

38

V

Logic control input pin current (SELx)(4)

–30

30

mA

Source or drain voltage (Sx, Dx)(4)

V

Diode clamp current(4)

–30

30

mA

Source or drain continuous current (Sx, Dx)

mA

Ambient temperature

–55

135

°C

Storage temperature

–65

150

°C

Junction temperature

140

°C

(1)

Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under

Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

(2)

The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum.

(3)

All voltages are with respect to ground, unless otherwise specified.

(4)

Pins are diode-clamped to the power-supply rails. Over voltage signals must be voltage and current limited to maximum ratings.

(5)

7.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/

JEDEC JS-001, all pins(1)

±2000

V

Charged device model (CDM), per JEDEC

specification JESD22-C101, all pins(2)

±500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Thermal Information

THERMAL METRIC(1)

TMUX721x

UNIT

PW (TSSOP)

RUM (WQFN)

16 PINS

16 PINS

Junction-to-ambient thermal resistance

94.5

TBD

°C/W

Junction-to-case (top) thermal resistance

25.5

TBD

°C/W

Junction-to-board thermal resistance

41.1

TBD

°C/W

Junction-to-top characterization parameter

1.1

TBD

°C/W

Junction-to-board characterization parameter

40.4

TBD

°C/W

Junction-to-case (bottom) thermal resistance

N/A

TBD

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

TMUX6211, TMUX6212, TMUX6213

SCDS431 – OCTOBER 2020

www.ti.com

4

Submit Document Feedback

Copyright © 2020 Texas Instruments Incorporated

Product Folder Links: TMUX6211 TMUX6212 TMUX6213