Table of Contents

1 Features............................................................................1

2 Applications..................................................................... 1

3 Description.......................................................................1

4 Revision History.............................................................. 2

5 Pin Configuration and Functions...................................3

6 Specifications.................................................................. 6

6.1 Absolute Maximum Ratings ....................................... 6

6.2 ESD Ratings .............................................................. 6

6.3 Recommended Operating Conditions ........................6

6.4 Thermal Information for Single Channel .................... 6

6.5 Thermal Information for Dual Channel .......................7

6.6 Thermal Information for Quad Channel ..................... 7

6.7 Electrical Characteristics ............................................8

6.8 Typical Characteristics.............................................. 11

7 Detailed Description......................................................18

7.1 Overview................................................................... 18

7.2 Functional Block Diagram......................................... 18

7.3 Feature Description...................................................19

7.4 Device Functional Modes..........................................26

8 Application Information Disclaimer............................. 27

8.1 Application Information............................................. 27

8.2 Typical Applications.................................................. 27

9 Power Supply Recommendations................................29

10 Layout...........................................................................29

10.1 Layout Guidelines................................................... 29

10.2 Layout Example...................................................... 30

11 Device and Documentation Support..........................32

11.1 Device Support........................................................32

11.2 Documentation Support.......................................... 32

11.3 Receiving Notification of Documentation Updates.. 32

11.4 Support Resources................................................. 32

11.5 Trademarks............................................................. 32

11.6 Electrostatic Discharge Caution.............................. 33

11.7 Glossary.................................................................. 33

12 Mechanical, Packaging, and Orderable

Information.................................................................... 34

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision B (August 2020) to Revision C (December 2020)

Page

• Changed SOIC (14) package in Device Information from Preview to Active......................................................1

• Changed TSSOP (14) package in Device Information from Preview to Active.................................................. 1

• Changed SOT-23 (5) package in Device Information from Preview to Active.................................................... 1

• Changed SC70 (5) package in Device Information from Preview to Active........................................................1

• Removed preview notation on SOT-23 (DBV) package in Pin Configurations and Functions section............... 3

• Removed preview notation on SC70 (DCK) package in Pin Configurations and Functions section.................. 3

• Removed preview notation on SOIC-14 (D) and TSSOP-14 (PW) packages in Pin Configurations and

Functions section................................................................................................................................................3

• Corrected package type column headings in the Pin Functions: TLV9351 table................................................3

• Added updates to the Related Documentation section.....................................................................................32

Changes from Revision A (March 2020) to Revision B (August 2020)

Page

• Updated the numbering format for tables, figures, and cross-references throughout the document..................1

• Added SOT-23 (8) package on Device Information section................................................................................1

• Removed preview notation on SOT-23 (DDF) package in Pin Configurations and Functions section............... 3

Changes from Revision * (November 2019) to Revision A (March 2020)

Page

• Changed SOIC (8) package status on Device Information from Preview to Active ........................................... 1

• Changed TSSOP (8) package status on Device Information from Preview to Active ........................................1

• Removed preview notation on SOIC-8 (D) and TSSOP-8 (PW) packages in Pin Configurations and Functions

............................................................................................................................................................................3

• Added Typical Characteristics section in Specifications section....................................................................... 11

TLV9351, TLV9352, TLV9354

SBOS994C – NOVEMBER 2019 – REVISED DECEMBER 2020

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