TLV9352IPWR datasheet(7/51 Pages) TI

7 / 51 page

6.5 Thermal Information for Dual Channel

THERMAL METRIC (1)

TLV9352

UNIT

(SOIC)

DDF

(SOT-23-8)

DGK (2)

(VSSOP)

(TSSOP)

8 PINS

RθJA

Junction-to-ambient thermal

resistance

138.7

143.5

177.1

185.1

°C/W

RθJC(top)

Junction-to-case (top) thermal

resistance

78.7

79.9

68.1

74.0

°C/W

RθJB

Junction-to-board thermal

resistance

82.2

61.6

98.4

115.7

°C/W

ψJT

Junction-to-top characterization

parameter

27.8

5.7

12.1

12.3

°C/W

ψJB

Junction-to-board characterization

parameter

81.4

61.3

96.6

114.0

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal

resistance

N/A

TBD

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

(2)

This package option is preview for TLV9352.

6.6 Thermal Information for Quad Channel

THERMAL METRIC (1)

TLV9354

UNIT

(SOIC)

(TSSOP)

14 PINS

RθJA

Junction-to-ambient thermal resistance

101.2

131.1

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

57.8

52.1

°C/W

RθJB

Junction-to-board thermal resistance

57.2

75.6

°C/W

ψJT

Junction-to-top characterization parameter

18.6

8.1

°C/W

ψJB

Junction-to-board characterization parameter

56.5

74.6

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

www.ti.com

TLV9351, TLV9352, TLV9354

SBOS994C – NOVEMBER 2019 – REVISED DECEMBER 2020

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