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ARRAYC Datasheet(PDF) 2 Page - ON Semiconductor |
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ARRAYC Datasheet(HTML) 2 Page - ON Semiconductor |
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2 / 29 page ![]() ArrayC Series www.onsemi.com 2 ARRAYC-60035-4P-BGA (2 x 2 ARRAY OF 6 mm SMT SENSORS) Array Size Sensor Type Readout Board Size Pixel Pitch No. Connections No. Connectors 2 x 2 60035 Pixel 14.2 x 14.2 mm2 7.2 mm 9 3 x 3 BGA The ARRAYC-60035-4P is comprised of 4 individual 6mm C-Series sensors arranged in a 2 x 2 array. The performance of the individual pixels and details of the bias to apply can be found in the C-Series datasheet. Connections to each sensor are provided by a BGA (ball grid array). The BGA can be used to mount the array on the user’s board using reflow soldering. The 4 SiPM sensors have all substrate connections (cathodes) connected together to form a common I/O. The 3 x 3 BGA provides connections as follows: • 4 x standard I/O • 5 x common I/O • There is NO fast output Schematics for the ARRAYC-60035-4P-BGA The complete ARRAYC-60035-4P-BGA CAD and solder footprint is available to download. |
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