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AMMP-6220 Datasheet(PDF) 7 Page - Agilent(Hewlett-Packard)

Part # AMMP-6220
Description  6-20 GHz Low Noise Amplifier
PDF  10 Pages
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Manufacturer  HP [Agilent(Hewlett-Packard)]
Direct Link  http://www.home.agilent.com
Logo HP - Agilent(Hewlett-Packard)

AMMP-6220 Datasheet(HTML) 7 Page - Agilent(Hewlett-Packard)

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7
Outline Drawing
Recommended SMT Attachment
The AMMP Packaged Devices are
compatible with high volume
surface mount PCB assembly
processes.
The PCB material and mounting
pattern, as defined in the data
sheet, optimizes RF performance
and is strongly recommended.
An electronic drawing of the land
pattern is available upon request
from Agilent Sales & Application
Engineering.
Manual Assembly
1. Follow ESD precautions while
handling packages.
2. Handling should be along the
edges with tweezers.
3. Recommended attachment is
conductive solder paste.
Please see recommended sol-
der reflow profile. Conductive
epoxy is not recommended.
Hand soldering is not recom-
mended.
4. Apply solder paste using a
stencil printer or dot place-
ment. The volume of solder
paste will be dependent on
PCB and component layout
and should be controlled to
ensure consistent mechanical
and electrical performance.
5. Follow solder paste and
vendor’s recommendations
when developing a solder
reflow profile. A standard
profile will have a steady ramp
up from room temperature to
the pre-heat temperature to
avoid damage due to thermal
shock.
6. Packages have been qualified to
withstand a peak temperature
of 260
°C for 20 seconds. Verify
that the profile will not expose
device beyond these limits.
Suggested PCB Material and Land Pattern
Figure 22.
Figure 23.
Figure 24.
3
2
1
4
8
BACK VIEW
0.012 (0.30)
0.016 (0.40)
0.014 (0.365)
0.011 (0.28)
0.018 (0.46)
0.114 (2.90)
0.100 (2.54)
0.100 (2.54)
0.059
(1.5)
0.126
(3.2)
0.029 (0.75)
56
7
0.016 (0.40)
0.93 (2.36)
0.028 (0.70)
NOTES:
1.
INDICATES PIN 1
2. DIMENSIONS ARE IN INCHES (MILLIMETERS)
3. DIMENSIONAL TOLERANCES: 0.002 INCH (0.5mm)
0.010
(0.25)
0.093
(2.36)
0.011 (0.28)
0.016(0.40)
0.0095 (0.24)
0.012 (0.30)
0.016 (0.40)
GROUND VIAS SHOULD
BE SOLDER FILLED
0.020 (0.50)
0.059 (1.50)
0.126 (3.20)
INCHES (MILLIMETERS).
MATERIAL IS ROGERS RO4350, 0.010-INCH THICK.
0.018 (0.46)
0.018 (0.46)
0.0095 (0.024)
0.114 (2.90)
1
2
3
7
6
5
4
8
0.075 (1.91)
0.200 (5.08)
0.200
(5.08)
AMMP
XXXX
YWWDNN
FRONT VIEW
SIDE VIEW



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