Scotch-Weld

TM

Polyurethane Reactive Adhesives

TE031 • TE040 • TS115 HGS • TS230

- 3 -

Handling/Curing

Information (continued)

Cleanup: Allow product to solidify. Remove uncured waxy material (usually within

the first 20 minutes after application) by scraping with a putty knife or similar tool.

For cured material, remove by cutting or sanding. Do not use heat or flame to

remove adhesive.

Cure Time: The cure rate will vary depending on air temperature, relative humidity,

substrate type and bond line thickness. Cure rate is more rapid on wood (moisture-

rich substrate) than on plastic.

Typical Performance

Characteristics

Note: The following technical information and data should be considered

representative or typical only and should not be used for specification

purposes.

A.

Overlap Shear Strength

Overlap shear (OLS) strengths were measured on 1" wide 1/2" overlap

specimens. These bonds were made individually using 1" x 4" sample coupons.

The thickness of the bond line was .003-.006". The thickness of the substrates

were: plastics, .125", Maple, .375".

The separation rate of the testing jaws was 2" per minute.

Overlap Shear Strength (psi), tested @ 73°F (23°C)

3M™ Scotch-Weld™ Polyurethane Reactive Adhesive

Substrate

TE031

TE040

TS115 HGS

TS230

Maple

1,372

1,334

1,722

1,210

FRP

1,199

1,205

1,1101

1,2411

Polycarbonate

1,374

1,331

1,373

1,822

Polyacrylic

1,2191

9531

1,0161

1,1101

ABS

1,2131

1,0941

1178

1,2721

PVC

1,795

1,3541

1,5831

1,7791

1Substrate failure

Overlap Shear Strength (psi), tested @ 180°F (82°C)

3M™ Scotch-Weld™ Polyurethane Reactive Adhesive

Substrate

TE031

TE040

TS115 HGS

TS230

Maple

499

382

109

340

FRP

421

377

53

368