ZSSC3170 Datasheet

© 2016 Integrated Device Technology, Inc.

3

May 30, 2016

Contents

1

ZSSC3170 Characteristics ............................................................................................................ 5

1.1

Absolute Maximum Ratings..................................................................................................... 5

1.2

Operating Conditions............................................................................................................... 6

1.3

Electrical Parameters .............................................................................................................. 6

1.4

Interface Characteristics........................................................................................................ 11

1.5

EEPROM .............................................................................................................................. 11

2

Circuit Description ....................................................................................................................... 12

2.1

Signal Flow and Block Diagram............................................................................................. 12

2.2

Application Modes ................................................................................................................. 13

2.3

Analog Front End (AFE) ........................................................................................................ 14

2.3.1

Programmable Gain Amplifier (PGA) ............................................................................... 14

2.3.2

Offset Compensation....................................................................................................... 14

2.3.3

Analog-to-Digital Converter ............................................................................................. 15

2.4

Temperature Measurement ................................................................................................... 17

2.5

System Control and Conditioning Calculation........................................................................ 18

2.5.1

Operating Modes ............................................................................................................. 18

2.5.2

Start-Up Phase................................................................................................................ 18

2.5.3

Measurement Cycle......................................................................................................... 19

2.5.4

Conditioning Calculation .................................................................................................. 20

2.6

Signal Outputs....................................................................................................................... 20

2.6.1

PWM Outputs HOUT and LOUT ...................................................................................... 20

2.6.2

LIN Output ....................................................................................................................... 21

2.7

Digital Test and Calibration Interface..................................................................................... 21

2.8

Diagnostic and Failsafe Features, Watchdog, and Error Detection ........................................ 21

2.9

High Voltage, Reverse Polarity, and Short Circuit Protection................................................. 21

3

Application Circuit Examples and External Components ............................................................. 22

3.1

Application Circuit Examples ................................................................................................. 22

3.2

Dimensioning of External Components.................................................................................. 23

4

Pinout and Package Options ....................................................................................................... 24

4.1

Die Pad Definitions and Configuration ................................................................................... 24

4.2

SSOP20 Package ................................................................................................................. 25

4.3

DFN20 Package.................................................................................................................... 25