LM1117

www.onsemi.com

2

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

Input Voltage (Note 1)

20

V

Output Short Circuit Duration (Notes 2 and 3)

−

Infinite

−

Power Dissipation and Thermal Characteristics

Case 318H (SOT−223)

Power Dissipation (Note 2)

Thermal Resistance, Junction−to−Ambient, Minimum Size Pad

Thermal Resistance, Junction−to−Case

Internally Limited

160

15

W

°C/W

°C/W

Maximum Die Junction Temperature Range

−55 to 150

°C

Storage Temperature Range

−65 to 150

°C

Operating Ambient Temperature Range

0 to +125

°C

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.

1. This device series contains ESD protection and exceeds the following tests:

Human Body Model (HBM), Class 2, 2000 V

Machine Model (MM), Class B, 200 V

Charge Device Model (CDM), Class IV, 2000 V.

2. Internal thermal shutdown protection limits the die temperature to approximately 175°C. Proper heatsinking is required to prevent activation.

The maximum package power dissipation is:

PD +

TJ(max) * TA

RqJA