LWE64 LQFP 0416 REV A

0° – 7°

11° – 13°

0.45 – 0.75

1.00 REF

11° – 13°

1

64

1.60

MAX

1.35 – 1.45

0.05 – 0.15

0.09 – 0.20

0.50

BSC

0.17 – 0.27

GAUGE PLANE

0.25

NOTE:

1. DIMENSIONS ARE IN MILLIMETERS

2. DIMENSIONS OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH

SHALL NOT EXCEED 0.25mm (10 MILS) BETWEEN THE LEADS AND

MAX 0.50mm (20 MILS) ON ANY SIDE OF THE EXPOSED PAD, MAX 0.77mm

(30 MILS) AT CORNER OF EXPOSED PAD, IF PRESENT

3. PIN-1 INDENTIFIER IS A MOLDED INDENTATION, 0.50mm DIAMETER

4. DRAWING IS NOT TO SCALE

R0.08 – 0.20

10.15 – 10.25

7.50 REF

7.50 REF

10.15 – 10.25

RECOMMENDED SOLDER PAD LAYOUT

APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED

BOTTOM OF PACKAGE—EXPOSED PAD (SHADED AREA)

SIDE VIEW

SECTION A – A

0.50 BSC

1.30 MIN

0.20 – 0.30

12.00 BSC

10.00 BSC

5.74 ±0.10

5.74 ±0.05

5.74 ±0.05

5.74 ±0.10

49

17

32

48

33

16

48

1

32

17

49

64

33

33

48

49

64

32

17

1

16

C0.30 – 0.50

LWE Package

64-Lead Plastic Exposed Pad LQFP (10mm

× 10mm)

(Reference LTC DWG #05-08-1982 Rev A)

16

SEE NOTE: 3

10.00 BSC

12.00 BSC

PACKAGE OUTLINE

A

A

LTC7871

47

Rev. 0

For more information www.analog.com

Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog

Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications

subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices.

PACKAGE DESCRIPTION