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MCT8316Z Datasheet(PDF) 86 Page - Texas Instruments |
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MCT8316Z Datasheet(HTML) 86 Page - Texas Instruments |
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86 / 91 page  NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for optimal thermal and mechanical performance. PACKAGE OUTLINE 4224999/A 06/2019 www.ti.com VQFN - 1 mm max height PLASTIC QUAD FLAT PACK- NO LEAD RGF0040E A 0.08 C 0.1 C A B 0.05 C B SYMM SYMM PIN 1 INDEX AREA 5.1 4.9 7.1 6.9 1 MAX 0.05 0.00 C (0.1) TYP 3.7±0.1 5.7±0.1 40X 0.3 0.2 3.5 5.5 36X 0.5 40X 0.5 0.3 PIN 1 ID (OPTIONAL) 1 12 13 20 21 32 33 40 41 SEATING PLANE MCT8316Z SLVSF18 – MARCH 2021 www.ti.com 86 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: MCT8316Z |
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