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The power dissipation data for the ESOP8 is shown as below. The value of power dissipation varies with the mount

board conditions. Please use this data as the reference data taken in the following condions.

3. Measurement condition

Condition:

Mount on a board

Ambient:

Natural convection

Soldering:

Lead(pb) free

Board:

Copper(Cu) traces occupy 50% of the board

Area in top and back faces

Material:

Glass Epoxy (FR-4)

Thickness:

1.6mm

Through-hole: 4*0.8 Diameter

4. Power dissipation vs. Ambient temperature

Evaluation Board( Unit:mm)

Ambient Temperature(℃)

Power Dissipation(mW)

Thermal Resistance(℃/W)

25

2000

66.67

85

700

Pd vs.Ta

0

400

800

1200

1600

2000

2400

25

35

45

55

65

75

85

95

105

115

125

Ambient temperature(℃)

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