CDHV datasheet(4/5 Pages) VISHAY

4 / 5 page

CDHV

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Vishay Techno

Revision: 19-May-2021

Document Number: 68020

For technical questions, contact: te1resistors@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

Notes

(1) Standard solder plating for the nickel barrier and non-magnetic parts is solder terminations E or T. Hot solder dipped terminations F or S are

also available

(2) Use solder termination N for applications requiring epoxy bondable mounting, and solder terminations F or S for applications requiring

solderable mounting

(3) While not recommended, palladium silver terminations could be used for solderable applications when using a solder alloy containing silver.

If the solder paste being used to solder the palladium silver terminated parts to the boards does not have a silver-based composition, then

the silver in the terminations could begin to leach when it is exposed to liquidus non-silver-based solders, causing the potential for

solderability and/or solder joint issues

TYPE

TERMINATION

MATERIAL

TERMINATION

STYLE

TERMINATION STYLE /

MATERIAL CODE

SOLDER TERMINATION

CODE

Solderable

Nickel barrier

3-sided (wraparound)

E or T (standard);

F or S (optional) (1)

Top only (flip chip)

Solderable

Non-magnetic

3-sided (wraparound)

E or T (standard);

F or S (optional) (1)

Top only (flip chip)

Epoxy bondable /

solderable

Platinum palladium gold

Top only (flip chip)

N (standard);

F or S (optional) (2)

Wire bondable /

epoxy bondable

Gold

Top only (flip chip)

Epoxy bondable

Palladium silver (3)

Top only (flip chip)

Platinum gold

Platinum silver

SCHEMATIC

Pin 1

Pin 3

Pin 2

OUT

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