CDHV

www.vishay.com

Vishay Techno

Revision: 19-May-2021

1

Document Number: 68020

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

Thick Film Chip Dividers, High Voltage

LINKS TO ADDITIONAL RESOURCES

FEATURES

• High voltage up to 3000 V

• Typical resistance ratios of 250:1 to a maximum

resistance ratio of 500:1

• Flow solderable

• Tape and reel packaging available

• Termination style: 3-sided wraparound termination or

single termination flip chip available

• Suitable for solderable, epoxy bondable, or wire bondable

applications

• Termination material: solder-coated nickel barrier or

solder coated non-magnetic terminations standard; gold,

palladium silver, platinum gold, platinum silver or platinum

palladium gold terminations available

• Multiple styles, termination materials and configurations,

allow wide design flexibility

• Epoxy

bondable

or

wire

bondable

non-magnetic

terminations available

• Material categorization: for definitions of compliance

Note

with lead (Pb) terminations are not RoHS-compliant. Please see the information / tables in this datasheet for details

Notes

or maximum working voltage, whichever is less

voltages available upon request

Note

• Contact factory for other ratios

333

DDD3 D

3D Models

Footprints

Available

Available

STANDARD ELECTRICAL SPECIFICATIONS

GLOBAL

MODEL

CASE

SIZE

POWER RATING

W

MAXIMUM

WORKING

V

RESISTANCE

Ω

± %

TEMPERATURE

(-55 °C to +155 °C)

± ppm/°C

TCR TRACKING

± ppm/°C

CDHV 2512

2512

1

3000

20M to 20G

1, 2, 5, 10, 20

100

50 (typical)

VOLTAGE AND TEMPERATURE COEFFICIENTS OF RESISTANCE CHART TYPICAL

RESISTANCE (

Ω)

RATIO (TYPICAL)

VCR (ppm/V)

TCR (ppm/°C) -55 °C to +155 °C

20M

250:1

10

100

150M

300:1

10

150

800M

500:1

10

200

P x R