Custom MMIC

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Die Outline (all dimensions in microns)

Mechanical Information

ver 1.7 0320

CMD217

28-32 GHz GaN Power Amplifier

Notes:

1. No connection required for unlabeled pads

2. Backside is RF and DC ground

3. Backside and bond pad metal: Gold

4. Die is 100 microns thick

5. DC bond pads (4, 5, 6) are 100 x 100 microns

6. RF bond pads (1, 3) are 100 x 150 microns

7. DC bond pad (2) is 150 x 100 microns

1

2

4

5

6

3

102.00

527.50

938.50

1099.00

2585.00

560.75

1520.00

2173.75

1405.00