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V3025 Datasheet(PDF) 2 Page - EM Microelectronic - MARIN SA

Part # V3025
Description  17Very Low Power 8-Bit 32 kHz RTC Module with Digital Trimming, User RAM and Battery Switch-over
PDF  17 Pages
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Manufacturer  EMMICRO [EM Microelectronic - MARIN SA]
Direct Link  http://www.emmicroelectronic.com
Logo EMMICRO - EM Microelectronic - MARIN SA

V3025 Datasheet(HTML) 2 Page - EM Microelectronic - MARIN SA

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R
V3025
Copyright © 2004, EM Microelectronic-Marin SA
2
www.emmicroelectronic.com
Absolute Maximum Ratings
Parameter
Symbol
Conditions
Maximum voltage at VDD and
VBAT
VSUPmax
VSS + 7.0V
Max. voltage at remaining pins VSUP
VDD + 0.3V
Min. voltage on all pins
Vmin
VSS – 0.3V
Maximum storage temperature TSTOmax
+125°C
Minimum storage temperature TSTOmin
-55°C
Maximum electrostatic
discharge to MIL-STD-883C
method 3015.7 with ref. to VSS
VSmax
1000V
Maximum soldering conditions TSmax
250°C x 10s
Shock resistance
5000 g.
0.3ms, ½ sine
Table 1
Stresses above these listed maximum ratings may cause
permanent damages to the device. Exposure beyond
specified operating conditions may affect device reliability
or cause malfunction.
Handling Procedures
This device has built-in protection against high static
voltages or electric fields; however, anti-static precautions
must be taken as for any other CMOS component. Unless
otherwise specified, proper operation can only occur when
all terminal voltages are kept within the voltage range.
Unused inputs must always be tied to a defined logic
voltage level.
Operating Conditions
Parameter
Symbol
Min
Typ
Max
Unit
Operating temperature
TA
-40
+85
°C
Main supply voltage
VDD
2
5.5
V
Battery supply voltage
VBAT
2
4
V
Logic supply voltage
VSUP
2.0
5.0
5.5
V
Supply voltage dv/dt
(power-up & down)
dv/dt
6
V/µs
Decoupling capacitor
100
nF
Table 2
Electrical Characteristics
VDD = 5.0V ±10%, VBAT = 3V, TA = -40 to +85°C, unless otherwise specified
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
Standby current (note 1)
IDD1
VDD = 3 V, VBAT = 0V, PFI = 0
1.2
10
µA
IDD2
VDD = 5.5 V, PFI = 0
2.5
15
µA
Standby current (note 1)
IBAT
VDD = 0 V, PFI = 0
1.3
10
µA
Dynamic current (note 2)
IDYN
CS
= 4 MHz, RD = VSS
WR
= VDD
1.5
mA
IRQ
(open drain)
Output low voltage
VOL
IOL = 6 mA
0.4
V
Output low voltage
VOL
IOL = 1 mA, VDD = 2 V
0.4
V
Inputs and Outputs
Input logic low
VIL
TA = +25°C
0.2 VSUP
V
Input logic high
VIH
TA = +25°C
0.8 VSUP
V
Output logic low
VOL
IOL = 6 mA
0.4
V
Output logic high
VOH
IOH = 6 mA
2.4
V
PFI
activation voltage
VPFL
0.5 VDD
V
PFI
hysteresis
VH
TA = +25°C
100
mV
Pullup on SYNC
ILS
VILS = 0.8 V
20
40
µA
Input leakage
IIN
VSS < VIN < VDD
5
1000
nA
Output tri-state leakage
ITS
CS
= 1
5
1000
nA
Oscillator Characteristics
Starting voltage
VSTA
TA ≥ +25°C
2
V
VSTA
2.5
V
Frequency Characteristics
Start-up time
TSTA
1
s
Frequency tolerance
∆f/f
TA = +25°C addr. 10 hex = 00
hex
150
210
(note 4)
251
ppm
Frequency stability
fsta
2.0 ≤ VDD ≤ 5.5 V (note 3)
1
5
ppm/V
Temperature stability
tsta
addr. 10 hex = 00 hex
see Fig.6
ppm
Aging
tag
TA = +25°C, first year
±5
ppm/year
Accuracy versus switch-
over
ASW
VBAT = 3V, 10 pulses of VDD
switching between 2 to 5V in
70ms
0.2
ppm
Table 3
Note 1
: With PFO = 0 (VSS) all I/O pads can be tri-state, tested.
With PFO = 1 (VSUP), CS = 1 (VDD) and all other I/O pads fixed to VSUP or VSS: same standby current, not tested.
Note 2
: All other inputs to VDD and all outputs open.
Note 3
: At a given temperature.
Note 4
: See Fig. 5



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