LTM8055 datasheet(2/22 Pages) AD

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LTM4693

Rev. 0

For more information www.analog.com

PIN CONFIGURATION

ABSOLUTE MAXIMUM RATINGS

Supply Voltages

VIN, VOUT ................................................. –0.3V to 6V

SW1, SW2 Voltage................................... –0.3V to 6V

All Other Pins............................................... –0.3V to 6V

Operating Junction Temperature

(Note 2).................................................. –40°C to 125°C

Storage Temperature Range .................. –55°C to 125°C

Peak Solder Reflow Body Temperature .................260°C

(Note 1)

TOP VIEW

LGA Package

25-LEAD (3.5mm × 4mm × 1.25mm)

TJMAX = 125°C, θJCtop = 34°C/W, θJCbottom = 6.5°C/W,

θJA = 38°C/W, WEIGHT = 39.4mg

VIN

GND

SW2

SW1

VOUT

GND

COMP

RUN/UVLO

MODE/SYNC

FREQ

ORDER INFORMATION

PART NUMBER

PAD OR BALL FINISH

PART MARKING*

JDEC

FINISH CODE

PACKAGE

TYPE

MSL

RATING

TEMPERATURE RANGE

(SEE NOTE 2)

DEVICE

FINISH CODE

LTM4693EV#PBF

Au (RoHS)

4693

LGA

–40°C to 125°C

LTM4693IV#PBF

• Contact the factory for parts specified with wider operating

temperature ranges. *Pad or ball finish code is per IPC/JEDEC

J-STD-609.

• Recommended LGA and BGA PCB Assembly and Manufacturing Procedures

• LGA and BGA Package and Tray Drawings

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