MAX6072 datasheet(2/21 Pages) MAXIM

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IN1, IN2 to GND ......................................................-0.3V to +6V

OUT1F to GND............ -0.3V to the lower of (VIN1 + 0.3V), +6V

OUT2F to GND............ -0.3V to the lower of (VIN2 + 0.3V), +6V

OUT1S, OUT2S to GND .........................................-0.3V to +6V

EN1, EN2 to GND ...................................................-0.3V to +6V

Continuous Power Dissipation (TA = +70°C)

µMAX (derate 5.6mW/°C above +70°C)......................444mW

Operating Temperature Range......................... -40°C to +125°C

Storage Temperature ....................................... -65°C to +150°C

Junction Temperature......................................................+150°C

Lead Temperature (soldering, 10s) .................................+300°C

Soldering Temperature ...................................................+260°C

μMAX

Junction-to-Ambient Thermal Resistance (θJA) ........180°C/W

Junction-to-Case Thermal Resistance (θJC)...............42°C/W

(Note 1)

MAX6072_50 Electrical Characteristics (VREF1: VOUT1F = 5V, VREF2: VOUT2F = 2.5V)

(VIN1 = VEN1 = VIN2 = VEN2 = +5.5V, IOUT = 0mA, COUT = 0.1μF, TA = -40°C to +125°C, unless otherwise noted. Typical values are at

TA =+25°C.) (Note 2)

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

OUTPUT

Output Voltage Accuracy (OUT1F

and OUT2F)

MAX6072A_50, TA = +25°C

-0.05

+0.05

MAX6072B_50, TA = +25°C

-0.08

+0.08

Output Voltage Temperature Drift

(OUT1F and OUT2F) (Note 3)

TCVOUT

MAX6072A_50

1.5

ppm/°C

MAX6072B_50

2.0

Output Voltage Temperature Drift

Tracking (OUT1F and OUT2F)

(Note 3)

∆TC

MAX6072A_50

0.4

ppm/°C

MAX6072B_50

0.4

Line Regulation

OUT1F, 5.2V

< VIN1 < 5.5V

TA = +25°C

200

620

μV/V

TA = -40°C to

+125°C

700

OUT2F, 2.8V

< VIN2 < 5.5V

TA = +25°C

260

TA = -40°C to

+125°C

275

Load Regulation

0mA < IOUT

< 10mA, sink

OUT1F

160

290

μV/mA

0mA < IOUT <

10mA, source

160

350

0mA < IOUT

< 10mA, sink

OUT2F

185

0mA < IOUT <

10mA, source

190

MAX6072

High-Precision, Dual-Output Series

Voltage Reference

www.maximintegrated.com

Maxim Integrated │ 2

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer

board. For detailed information on package thermal considerations, refer to

www.maximintegrated.com/thermal-tutorial.

Absolute Maximum Ratings

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these

or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

Package Thermal Characteristics

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