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MAX5705 Datasheet(PDF) 2 Page - Maxim Integrated Products

Part # MAX5705
Description  Ultra-Small, Single-Channel, 8-/10-/12-Bit Buffered Output Voltage DACs with Internal Reference and SPI Interface
PDF  26 Pages
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Manufacturer  MAXIM [Maxim Integrated Products]
Direct Link  https://www.maximintegrated.com/en.html
Logo MAXIM - Maxim Integrated Products

MAX5705 Datasheet(HTML) 2 Page - Maxim Integrated Products

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MAX5703/MAX5704/MAX5705
Ultra-Small, Single-Channel, 8-/10-/12-Bit Buffered Output
Voltage DACs with Internal Reference and SPI Interface
2
Maxim Integrated
VDD to GND.............................................................-0.3V to +6V
VDDIO to GND .........................................................-0.3V to +6V
OUT, REF to GND ........-0.3V to lower of (VDD + 0.3V) and +6V
CS, SCLK, DIN, AUX, LDAC to GND ......................-0.3V to +6V
Continuous Power Dissipation (TA = +70NC)
TDFN (derate 14.9mW/NC above +70NC)...............1188.7mW
µMAX (derate 8.8mW/NC above +70NC) ..................707.3mW
Maximum Continuous Current into Any Pin .................... ±50mA
Operating Temperature Range........................ -40NC to +125NC
Storage Temperature Range............................ -65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
TDFN
Junction-to-Ambient Thermal Resistance (
θJA) .......67.3NC/W
µMAX
Junction-to-Ambient Thermal Resistance (
θJA) .....113.1NC/W
Junction-to-Ambient Thermal Resistance (
θJC)...........36NC/W
ABSOLUTE MAXIMUM RATINGS
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegated.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
ELECTRICAL CHARACTERISTICS
(VDD = 2.7V to 5.5V, VDDIO = 1.8V to 5.5V, VGND = 0V, CL = 200pF, RL = 2kI , TA = -40NC to +125NC, unless otherwise noted.)
(Note 2)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
DC PERFORMANCE (Note 3)
Resolution and Monotonicity
N
MAX5703
8
Bits
MAX5704
10
MAX5705
12
Integral Nonlinearity (Note 4)
INL
MAX5703, 8 bits
-0.25
±0.05
+0.25
LSB
MAX5704, 10 bits
-0.5
±0.2
+0.5
MAX5705, 12 bits
-1
±0. 5
+1
Differential Nonlinearity (Note 4)
DNL
MAX5703, 8 bits
-0.25
±0.05
+0.25
LSB
MAX5704, 10 bits
-0.5
±0.1
+0.5
MAX5705, 12 bits
-1
±0.2
+1
Offset Error (Note 5)
OE
-5
±0.5
+5
mV
Offset Error Drift
±10
F
V/NC
Gain Error (Note 5)
GE
-1.0
±0.1
+1.0
%FS
Gain Temperature Coefficient
With respect to VREF
±2.5
ppm of
FS/NC
Zero-Scale Error
0
+10
mV
Full-Scale Error
With respect to VREF
-0.5
+0.5
%FS



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