Table of Contents

1 Features............................................................................1

2 Applications..................................................................... 1

3 Description.......................................................................1

4 Revision History.............................................................. 2

5 Device Comparison Table...............................................3

6 Pin Configuration and Functions...................................3

7 Specifications.................................................................. 5

7.1 Absolute Maximum Ratings ....................................... 5

7.2 ESD Ratings .............................................................. 5

7.3 Thermal Information ...................................................6

7.4 Recommended Operating Conditions ........................6

7.5 Source or Drain Continuous Current ..........................6

7.6 ±15 V Dual Supply: Electrical Characteristics ...........7

7.7 ±15 V Dual Supply: Switching Characteristics .......... 8

7.8 36 V Single Supply: Electrical Characteristics ........ 10

7.9 36 V Single Supply: Switching Characteristics ........11

7.10 12 V Single Supply: Electrical Characteristics ...... 13

7.11 12 V Single Supply: Switching Characteristics ......14

7.12 ±5 V Dual Supply: Electrical Characteristics .........16

7.13 ±5 V Dual Supply: Switching Characteristics ........ 17

7.14 Typical Characteristics............................................ 19

8 Parameter Measurement Information.......................... 24

8.1 On-Resistance.......................................................... 24

8.2 Off-Leakage Current................................................. 24

8.3 On-Leakage Current................................................. 25

8.4 Transition Time......................................................... 25

8.5 tON(EN) and tOFF(EN) .................................................. 26

8.6 Break-Before-Make...................................................26

8.7 tON (VDD) Time............................................................27

8.8 Propagation Delay.................................................... 27

8.9 Charge Injection........................................................28

8.10 Off Isolation.............................................................28

8.11 Crosstalk................................................................. 29

8.12 Bandwidth............................................................... 29

8.13 THD + Noise........................................................... 30

8.14 Power Supply Rejection Ratio (PSRR)................... 30

9 Detailed Description......................................................31

9.1 Overview................................................................... 31

9.2 Functional Block Diagram......................................... 31

9.3 Feature Description...................................................31

9.4 Device Functional Modes..........................................33

9.5 Truth Tables.............................................................. 33

10 Application and Implementation................................ 34

10.1 Application Information........................................... 34

10.2 Typical Application.................................................. 34

10.3 Design Requirements............................................. 35

10.4 Detailed Design Procedure..................................... 35

10.5 Application Curve....................................................36

11 Power Supply Recommendations..............................36

12 Layout...........................................................................37

12.1 Layout Guidelines................................................... 37

12.2 Layout Example...................................................... 38

13 Device and Documentation Support..........................39

13.1 Documentation Support.......................................... 39

13.2 Receiving Notification of Documentation Updates..39

13.3 Support Resources................................................. 39

13.4 Trademarks.............................................................39

13.5 Electrostatic Discharge Caution..............................39

13.6 Glossary..................................................................39

14 Mechanical, Packaging, and Orderable

Information.................................................................... 39

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision B (April 2021) to Revision C (August 2021)

Page

• Changed the status of the QFN package for the TMUX6208 and TMUX6209 from: preview to: active ............1

• Added ESD detail for RUM package.................................................................................................................. 5

• Added the Integrated Pull-Down Resistor on Logic Pins section......................................................................31

• Updated the Ultra-Low Charge Injection section.............................................................................................. 32

• Updated the TMUX620x Layout Example figures in the Layout Example section............................................38

Changes from Revision A (January 2021) to Revision B (April 2021)

Page

• Added thermal information for QFN package..................................................................................................... 6

Changes from Revision * (November 2020) to Revision A (January 2021)

Page

• Changed the document status From: Advanced Information To: Production Data ............................................1

TMUX6208, TMUX6209

SCDS419C – NOVEMBER 2020 – REVISED AUGUST 2021

www.ti.com

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