Data Sheet

ADR1399

ABSOLUTE MAXIMUM RATINGS

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Rev. 0 | 4 of 11

Table 3.

Parameter

Rating

Temperature Stabilizer

40 V

Reverse Breakdown Current

20 mA

Forward Current

1 mA

Reference to Substrate Voltage

–0.1 V

Temperature

Operating Range

0°C to 70°C

Storage Range

−65°C to +150°C

Lead, Soldering (10 sec)

300°C

Stresses at or above those listed under Absolute Maximum Ratings

may cause permanent damage to the product. This is a stress

rating only; functional operation of the product at these or any other

conditions above those indicated in the operational section of this

specification is not implied. Operation beyond the maximum operat-

ing conditions for extended periods may affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to the printed circuit board

(PCB) design and operating environment. Close attention to the

PCB thermal design is required.

To reduce heater power, avoid bringing ground planes close to the

device except on the bottom of the PCB, and use a mesh ground

instead of a solid plane. In addition, mounting the device at the

full height of its leads, approximately 1 cm above the PCB surface

reduces the heater power.

Table 4. Thermal Resistance

Package Type

Unit

TO-46

2-Layer JEDEC Board

220

Not

applicable1

°C/W

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Charged devi-

ces and circuit boards can discharge without detection. Although

this product features patented or proprietary protection circuitry,

damage may occur on devices subjected to high energy ESD.

Therefore, proper ESD precautions should be taken to avoid

performance degradation or loss of functionality.