6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

–0.3

6

V

Input Voltage (IN+, IN–)(2)

V

V

Output Voltage (OUT)(3)

V

Latch and Hysteresis Control (LE/HYS)

V

Current into Input pins (IN+, IN–, LE/HYS)(2)

±10

mA

Current into Output pins (OUT)(3)

±50

mA

150

°C

–65

150

°C

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.

If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully

functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.

(2)

Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.3 V beyond the supply rails must

be current-limited to 10 mA or less.

(3)

Output terminals are diode-clamped to the power-supply rails. Output signals that can swing more than 0.3 V beyond the supply rails

must be current-limited to 50 mA or less.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic

discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V

Charged-device model (CDM), per ANSI/ESDA/JEDEC JS-002(2)

±1000

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

2.4

5.5

V

Input Voltage Range (IN+, IN–)

V

Latch and Hysteresis Control (LE/HYS)

V

–40

125

°C

6.4 Thermal Information

THERMAL METRIC

TLV3601

TLV3601

TLV3603

UNIT

DCK (SC70)

DBV (SOT-23)

DCK (SC70)

5 PINS

5 PINS

6 PINS

Junction-to-ambient thermal resistance

187.5

176.5

165.1

°C/W

JC(top)

Junction-to-case (top) thermal resistance

139.2

74.7

129.1

°C/W

JC(bottom

)

Junction-to-case (bottom) thermal resistance

N/A

N/A

N/A

°C/W

Junction-to-board thermal resistance

65.8

43.4

58.9

°C/W

Junction-to-top characterization parameter

43.0

16.7

39.4

°C/W

Junction-to-board characterization parameter

65.5

43.1

58.7

°C/W

TLV3601, TLV3603

SNOSDB1B – JUNE 2021 – REVISED NOVEMBER 2021

www.ti.com

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