7 Specifications

7.1 Absolute Maximum Ratings: TMUX821x Devices

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

Supply voltage

110

V

–0.5

110

V

–110

0.5

V

Logic control input pin voltage (SELx)

–0.5

50

V

Logic control input pin current (SELx)

–30

30

mA

Source or drain voltage (Sx, Dx)

V

Source or drain continuous current (Sx, Dx)

–200

200

mA

Diode clamp current at 85°C

–100

100

mA

Diode clamp current at 125°C

–15

15

mA

Storage temperature

–65

150

°C

Ambient temperature

–55

150

°C

Junction temperature

150

°C

Total power dissipation (QFN)

1680

mW

Total power dissipation (TSSOP)

720

mW

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute maximum ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.

If briefly operating outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not

sustain damage, but it may not be fully functional. Operating the device in this manner may affect device reliability, functionality,

performance, and shorten the device lifetime.

(2)

Signal path pins are diode-clamped to the power-supply rails. Over voltage signals must be voltage and current limited to maximum

ratings.

(3)

(4)

7.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)

±2000

V

Charged device model (CDM), per ANSI/ESDA/JEDEC JS-002, all pins(2)

±500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

TMUX8212

SCDS434A – OCTOBER 2021 – REVISED DECEMBER 2021

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