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TMUX8212 Datasheet(PDF) 23 Page - Texas Instruments

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Part # TMUX8212
Description  TMUX821x 100-V, Flat Ron, 1:1 (SPST), 4-Channel Switches with Latch-Up Immunity and 1.8-V Logic
PDF  32 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

TMUX8212 Datasheet(HTML) 23 Page - Texas Instruments

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9.3.3.2 ESD Protection
All pins support HBM ESD protection level up to ±2 kV, which helps protect the devices from ESD events during
the manufacturing process.
9.3.3.3 Latch-Up Immunity
Latch-up is a condition where a low impedance path is created between a supply pin and ground. This condition
is caused by a trigger (current injection or overvoltage), but once activated the low impedance path remains
even after the trigger is no longer present. This low impedance path may cause system upset or catastrophic
damage due to excessive current levels. The latch-up condition typically requires a power cycle to eliminate the
low impedance path.
In the TMUX821x devices, an insulating oxide layer is placed on top of the silicon substrate to prevent any
parasitic junctions from forming. As a result, the devices are latch-up immune under all circumstances by device
construction.
The TMUX821x devices are constructed on silicon on insulator (SOI) based process where an oxide layer is
added between the PMOS and NMOS transistor of each CMOS switch to prevent parasitic structures from
forming. The oxide layer is also known as an insulating trench and prevents triggering of latch up events due
to overvoltage or current injections. The latch-up immunity feature allows the TMUX821x to be used in harsh
environments. For more information on latch-up immunity refer to Using Latch Up Immune Multiplexers to Help
Improve System Reliability.
9.3.4 1.8 V Logic Compatible Inputs
The TMUX821x devices have 1.8 V logic compatible control for all logic control inputs. 1.8 V logic level inputs
allows the TMUX821x to interface with processors that have lower logic I/O rails and eliminates the need for an
external translator, which saves both space and BOM cost. For more information on 1.8 V logic implementations
refer to Simplifying Design with 1.8 V logic Muxes and Switches.
9.3.5 Integrated Pull-Down Resistor on Logic Pins
The TMUX821x have internal weak pull-down resistors to GND to ensure the logic pins are not left floating. The
value of this pull-down resistor is approximately 4 MΩ, but is clamped to 1 µA at higher voltages. This feature
integrates up to four external components and reduces system size and cost.
www.ti.com
TMUX8212
SCDS434A – OCTOBER 2021 – REVISED DECEMBER 2021
Copyright © 2021 Texas Instruments Incorporated
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