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AS3610/11

Datasheet - A b s o l u t e M a x i m u m R a t i n g s

5 Absolute Maximum Ratings

Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of

the device at these or any other conditions beyond those indicated in Operating Conditions on page 5 is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

Table 2. Absolute Maximum Ratings

Symbol

Parameter

Min

Max

Unit

Comments

Electrical Parameters

High voltage pins

-2

22

V

Applicable to high voltage pins: VBUS, SW, STAT

5V pins

-0.3

7.0

V

Applicable to 5V-pins: VBAT, XEN, SDA, SCL,

USB500, I_SET, I_TERM

3.3V pins

-0.3

5.0

V

Applicable to 3.3V-Pins: VDD_INT, NTC

Input pin current

-100

+100

mA

Norm: JEDEC JESD78

Electrostatic Discharge

Electrostatic discharge

+/-1500

1

1. pin STAT is +/-750V only

V

Norm: JEDEC JESD22-A114F

Temperature Ranges and Storage Conditions

SCSB

Operating Temperature

-40

+85

ºC

Junction Temperature

+110

ºC

Storage Temperature Range

-55

+150

ºC

Humidity non-condensing

5

85

%

Temperature (soldering)

Package Body Temperature

260

ºC

Norm IPC/JEDEC J-STD-020

2

The lead finish for Pb-free leaded packages is matte tin

(100% Sn)

2. The reflow peak soldering temperature (body temperature) is specified according IPC/JEDEC J-STD-020 “Moisture/Reflow Sensitivity

Classification for Nonhermetic Solid State Surface Mount Devices”

Moisture Sensitive Level

3

Represents a max. floor life time of 168h