MIC69301/2/3

DS20006625A-page 18

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2021 Microchip Technology Inc. and its subsidiaries

RECOMMENDED LAND PATTERN

Dimension Limits

Units

Optional Center Pad Width

Optional Center Pad Length

Contact Pitch

Y2

X2

2.45

3.15

MILLIMETERS

1.27 BSC

MIN

E

MAX

Contact Pad Length (X8)

Contact Pad Width (X8)

Y1

X1

1.60

0.60

NOM

12

8

C

Contact Pad Spacing

5.40

Contact Pad to Center Pad (X8)

G1

0.68

Thermal Via Diameter

V

Thermal Via Pitch

EV

0.30

1.00

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during

reflow process

1.

2.

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

Microchip Technology Drawing C04-1136 Rev A

8-Lead Small Outline Integrated Circuit Package (EQA) - 3.90 mm (1.50 In) Body [SOIC]

With 3.10x2.41 mm Exposed Pad

E

X1

Y1

Y2

X2

EV

EV

C

G1

ØV

G2

Contact Pad to Contact Pad (X6)

G2

0.67

SILK SCREEN