MIC69301 datasheet(12/26 Pages) MICROCHIP

12 / 26 page

MIC69301/2/3

DS20006625A-page 12



2021 Microchip Technology Inc. and its subsidiaries

The ground current is approximated by using numbers

from the Electrical Characteristics table or Typical

Performance Curves section. The heat sink thermal

resistance is then determined with this formula:

EQUATION 4-3:

The heat sink may be significantly reduced in

applications where the minimum input voltage is known

and is large compared with the dropout voltage. Use a

series input resistor to drop excessive voltage and

distribute the heat between this resistor and the

regulator. The low dropout properties of Microchip

Super ßeta PNP regulators allow significant reductions

in regulator power dissipation and the associated heat

sink without compromising performance. When this

technique is employed, a capacitor of at least 1.0 µF is

needed directly between the input and regulator

ground.

Refer to Application Note 9 for further details and

examples on thermal design and heat sink

applications.

SA

TJ MAX





–

--------------------------------









JC CS





–

Where:

TJ(MAX) ≤ 125°C.

θCS = Between 0°C/W and 2°C/W.

MIC69301 Datasheet(PDF) 12 Page - Microchip Technology