MIC5207 datasheet(6/24 Pages) MICROCHIP

6 / 24 page

MIC5207

DS20005719C-page 6



2017 - 2022 Microchip Technology Inc. and its subsidiaries

TEMPERATURE SPECIFICATIONS (Note 1)

Parameters

Sym.

Min.

Typ.

Max.

Units

Conditions

Temperature Ranges

Storage Temperature Range

–65

—

+150

°C

—

Lead Temperature

—

+260

°C

Soldering, 5 sec.

Junction Temperature

(2.5 ≤ VOUT ≤ 15V)

–40

—

+125

°C

All, except 1.8V

Junction Temperature

(1.8V ≤ VOUT < 2.5V)

—

+125

°C

1.8V only

Package Thermal Resistance

Thermal Resistance SOT-23

θJA

—

235

—

°C/W

—

θJC

—

130

—

Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable

junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the

maximum allowable power dissipation will cause the device operating junction temperature to exceed the

maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.

MIC5207 Datasheet(PDF) 6 Page - Microchip Technology

MIC5207 Datasheet(HTML) 6 Page - Microchip Technology

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24

Datasheet Download

Link URL