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MPC8535EEC Datasheet(PDF) 111 Page - NXP Semiconductors |
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MPC8535EEC Datasheet(HTML) 111 Page - NXP Semiconductors |
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111 / 127 page  Electrical Characteristics MPC8535E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 7 Freescale Semiconductor 111 Figure 72. System-Level Thermal Model for the Chip (Not to Scale) The Flotherm library files of the parts have a dense grid to accurately capture the laminar boundary layer for flow over the part in standard JEDEC environments, as well as the heat spreading in the board under the package. In a real system, however, the part will require a heat sink to be mounted on it. In this case, the predominant heat flow path will be from the die to the heat sink. Grid density lower than currently in the package library file will suffice for these simulations. The user will need to determine the optimal grid for their specific case. 2.24.3 Thermal Management Information This section provides thermal management information for the flip chip plastic ball grid array (FC-PBGA) package for air-cooled applications. Proper thermal control design is primarily dependent on the system-level design—the heat sink, airflow, and thermal interface material. |
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