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LM3205 Datasheet(PDF) 11 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor. Click here to check the latest version.
Part # LM3205
Description  650mA Miniature, Adjustable, Step-Down DC-DC Converter for RF Power Amplifiers
PDF  18 Pages
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Manufacturer  NSC [National Semiconductor (TI)]
Direct Link  http://www.national.com
Logo NSC - National Semiconductor (TI)

LM3205 Datasheet(HTML) 11 Page - National Semiconductor (TI)

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Block Diagram
Operation Description
The LM3205 is a simple, step-down DC-DC converter opti-
mized for powering RF power amplifiers (PAs) in mobile
phones, portable communicators, and similar battery pow-
ered RF devices. It is designed to allow the RF PA to operate
at maximum efficiency over a wide range of power levels
from a single Li-Ion battery cell. It is based on a current-
mode buck architecture, with synchronous rectification for
high efficiency. It is designed for a maximum load capability
of 650mA in PWM mode.
Maximum load range may vary from this depending on input
voltage, output voltage and the inductor chosen.
Efficiency is typically around 96% for a 400mA load with 3.4V
output, 4.2V input. The output voltage is dynamically pro-
grammable from 0.8V (typ.) to 3.6V (typ.) by adjusting the
voltage on the control pin without the need for external
feedback resistors. This ensures longer battery life by being
able to change the PA supply voltage dynamically depending
on its transmitting power.
Additional features include current overload protection and
thermal overload shutdown.
The LM3205 is constructed using a chip-scale 8-pin mi-
croSMD or 10-pin LLP package. These packages offers the
smallest possible size, for space-critical applications such as
cell phones, where board area is an important design con-
sideration. Use of a high switching frequency (2MHz) re-
duces the size of external components. As shown in Figure
1, only three external power components are required for
implementation. Use of a microSMD package requires spe-
cial design considerations for implementation. (See mi-
croSMD Package Assembly and use in the Applications
Information section.) Its fine bump-pitch requires careful
board design and precision assembly equipment. Use of this
package is best suited for opaque-case applications, where
its edges are not subject to high-intensity ambient red or
infrared light. Also, the system controller should set EN low
during power-up and other low supply voltage conditions.
(See Shutdown Mode in the Device Information section.)
20158035
FIGURE 2. Functional Block Diagram
www.national.com
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