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LM3205 Datasheet(PDF) 15 Page - National Semiconductor (TI) |
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LM3205 Datasheet(HTML) 15 Page - National Semiconductor (TI) |
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15 / 18 page ![]() Board Layout Considerations The LM3205 converts higher input voltage to lower output voltage with high efficiency. This is achieved with an inductor-based switching topology. During the first half of the switching cycle, the internal PMOS switch turns on, the input voltage is applied to the inductor, and the current flows from P VDD line to the output capacitor (C2) through the inductor. During the second half cycle, the PMOS turns off and the internal NMOS turns on. The inductor current continues to flow via the inductor from the device PGND line to the output capacitor (C2). Referring toFigure 4 , the LM3205 has two major current loops where pulse and ripple current flow. The loop shown in the left hand side is most important, because pulse current shown inFigure 4 flows in this path. The right hand side is next. The current waveform in this path is triangular, as shown in Figure 4 . Pulse current has many high-frequency components due to fast di/dt. Triangular ripple current also has wide high-frequency components. Board layout and cir- cuit pattern design of these two loops are the key factors for reducing noise radiation and stable operation. Other lines, such as from battery to C1(+) and C2(+) to load, are almost DC current, so it is not necessary to take so much care. Only pattern width (current capability) and DCR drop consider- ations are needed. BOARD LAYOUT FLOW (microSMD) 1. Minimize C1, PV IN, and PGND loop. These traces should be as wide and short as possible. This is most important. 2. Minimize L1, C2, SW and PGND loop. These traces also should be wide and short. This is the second priority. 20158008 FIGURE 4. Current Loop 20158009 FIGURE 5. Evaluation Board Layout for microSMD www.national.com 15 |
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