6 Specifications

6.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

93

V

Signal input pin voltage(2)

(V–) – 0.1

(V+) + 0.1

V

E/D to E/D Com pin voltage

5.5

V

ILIMIT pin voltage

V–

(V–) + 3.35

V

All input pins current(2)

±10

mA

Output short circuit current(3)

Continuous

Operating temperature

–55

125

°C

Junction temperature

150

°C

Storage temperature

–55

125

°C

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.

If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully

functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.

(2)

Input pins, Status Flag, E/D, and E/D Com, and Output are diode-clamped to the power-supply rails. Input signals that can swing more

than 0.3 V beyond the supply rails must be current-limited to 10 mA or less.

(3)

Short-circuit to ground.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V

Charged-device model (CDM), per ANSI/ESDA/JEDEC JS-002(2)

±500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

Over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Single supply voltage

10

85

V

Dual supply voltage

±5

±42.5

Operating temperature

–40

125

°C

6.4 Thermal Information

THERMAL METRIC(1)

OPA593

UNIT

DNT (WSON)

12 PINS

Junction-to-ambient thermal resistance

40.8

℃/W

Junction-to-case (top) thermal resistance

30.2

℃/W

Junction-to-board thermal resistance

17.8

℃/W

Junction-to-top characterization parameter

0.3

℃/W

Junction-to-board characterization parameter

17.7

℃/W

Junction-to-case (bottom) thermal resistance

4.3

℃/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

OPA593

SBOS659A – JANUARY 2022 – REVISED MARCH 2022

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