9 Power Supply Recommendations

The OPA593 operates from power supplies up to ±42.5 V, or a total of 85 V, with excellent performance. Most

behavior remains unchanged throughout the full operating voltage range. A power-supply bypass capacitor of at

least 0.1 µF is required for proper operation. Make sure that the capacitor voltage rating is suitable for the high

voltage across the full operating temperature range. Parameters that vary significantly with operating voltage are

shown in Section 6.6.

Some applications do not require an equal positive and negative output voltage swing. Power-supply voltages

do not have to be equal. The OPA593 operates with as little as 10 V between the supplies, and with up to 85 V

between the supplies.

10 Layout

10.1 Layout Guidelines

During the surface-mount solder operation (when the leads are being soldered), the thermal pad must be

soldered to a copper area underneath the package. Through the use of thermal paths within this copper area,

heat is conducted away from the package into either a ground plane or other heat-dissipating device. Always

solder the thermal pad to the PCB, even with applications that have low power dissipation. Follow these steps to

attach the device to the PCB:

1. Connect the thermal pad to the most negative supply voltage on the device, V–.

2. Prepare the PCB with a top-side etch pattern. There must be etching for the leads, as well as etching for the

thermal pad.

3. Thermal vias improve heat dissipation, but are not required. The thermal pad can connect to the PCB using

an area equal to the pad size with no vias, but must be externally connected to V–.

4. Place recommended holes in the area of the thermal pad. Recommended thermal land size and thermal via

patterns for the SON-12 DNT package are shown in the thermal land pattern mechanical drawing appended

at the end of this document. Keep the holes small, so that solder wicking through the holes is not a problem

during reflow. Use a 0.2-mm size via with a minimum of five connected directly below the thermal pad.

5. Additional vias can be placed anywhere along the thermal plane outside of the thermal pad area. These vias

help dissipate the heat generated by the OPA593 device. These additional vias may be larger than the vias

directly under the thermal pad because they are not in the thermal pad area to be soldered; thus, wicking is

not a problem.

6. Connect all holes to the internal power plane of the correct voltage potential, V–.

7. When connecting these holes to the plane, do not use the typical web or spoke via connection methodology.

Web connections have a high thermal resistance connection that is useful for slowing the heat transfer

during soldering operations, making the soldering of vias that have plane connections easier. In this

application, however, low thermal resistance is desired for the most efficient heat transfer. Therefore, the

holes under the OPA593 WSON package must make the connections to the internal plane with a complete

connection around the entire circumference of the plated-through hole.

8. The top-side solder mask must leave the pins of the package and the thermal pad area exposed. The

bottom-side solder mask must cover the holes of the thermal pad area. This masking prevents solder from

being pulled away from the thermal pad area during the reflow process.

9. Apply solder paste to the exposed thermal pad area and all of the device pins.

10. With these preparatory steps in place, simply place the device in position, and run through the solder reflow

operation as with any standard surface-mount component.

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OPA593

SBOS659A – JANUARY 2022 – REVISED MARCH 2022

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