NOTES:

1. All dimensions are in millimeters (angles in degrees).

2. Dimensioning and tolerancing per ANSI Y14.5M-1982.

3. Dimension “D” does not include mold flash, protrusions or gate burrs.

4. Dimension “E1” does not include internal flash or protrusion.

5. Dimension “b” does not include Dambar protrusion.

6. “N” is the maximum number of lead terminal positions for the specified package length.

7. Datums −A− and −B− to be determined at datum plane −H− .

8. Dimensions “D” and “E1” are to be determined at datum plane −H− .

9. Cross section B-B to be determined at 0.10 to 0.25 mm from the lead tip.

10. Refer to JEDEC MO-153, Issue C., Variation ABT.

11. Exposed pad will depend on the pad size of the L/F.

Package Information

Vishay Siliconix

www.vishay.com

2 of 2

Document Number: 72778

31-Mar-05

POWER IC THERMALLY ENHANCED PowerPAKR TSSOP: 14/16-LEAD

MILLIMETERS

INCHES*

Dim

Min

Nom

Max

Min

Nom

Max

A

−

−

1.20

−

−

0.0472

0.025

−

0.100

0.001

−

0.0039

0.80

0.90

1.05

0.0315

0.0354

0.0413

b

0.19

−

0.30

0.0075

−

0.0118

b1

0.19

0.22

0.25

0.0075

0.0087

0.0098

c

0.09

−

0.20

0.0035

−

0.0079

c1

0.09

−

0.16

0.0035

−

0.0063

D

4.9

5.0

5.1

0.1929

0.1968

0.2008

e

0.65 BSC

0.0256 BSC

E

6.2

6.4

6.6

0.2441

0.2520

0.2598

4.3

4.4

4.5

0.1693

0.1732

0.1772

L

0.45

0.60

0.75

0.0177

0.0236

0.0295

L1

1.0 REF

0.0394 REF

R

0.09

−

−

0.0035

−

−

R1

0.09

−

−

0.0035

−

−

q1

0

−

0

0

−

0

N (14)

14

14

N (16)

16

16

X

2.95

3.0

3.05

0.116

0.118

0.120

Y (14)

3.15

3.2

3.25

0.124

0.126

0.128

Y (16)

2.95

3.0

3.05

0.116

0.118

0.120

aaa

0.10

0.0039

bbb

0.10

0.0039

ccc

0.05

0.0020

ddd

0.20

0.0079

ECN: S-50568—Rev. B, 04-Apr-05

DWG: 5913

*Dimensions are in mm converted to inches.