NXP Semiconductors

NTS0102

Dual supply translating transceiver; open-drain; auto direction sensing

4 Ordering information

Package

Type number

Topside

marking Name

Description

Version

NTS0102DP

s02

TSSOP8

plastic thin shrink small outline package; 8 leads; body width

3 mm; lead length 0.5 mm

SOT505-2

NTS0102GT

s02

XSON8

plastic extremely thin small outline package; no leads; 8

terminals; body 1 × 1.95 × 0.5 mm

SOT833-1

NTS0102GD

s02

XSON8

plastic extremely thin small outline package; no leads; 8

terminals; body 3 × 2 × 0.5 mm

SOT996-2

NTS0102GF

s2

XSON8

extremely thin small outline package; no leads; 8 terminals;

body 1.35 × 1 × 0.5 mm

SOT1089

NTS0102TL

tS2

XSON8

plastic extremely thin small outline package; no leads; 8

terminals; body 3 x 2 x 0.5 mm

SOT1052-2

Table 1. Ordering information

4.1 Ordering options

Type number

Orderable part

number

Package

Packing

method[1]

Minimum order

quantity

Temperature

NTS0102DP

NTS0102DP,125

TSSOP8

Reel 7" Q3 NDP

3000

–40 °C to +125 °C

NTS0102GT

NTS0102GT,115

XSON8

Reel 7" Q1 NDP

5000

–40 °C to +125 °C

NTS0102GD[2]

NTS0102GD,125

XSON8

Reel 7" Q3 NDP

3000

–40 °C to +125 °C

NTS0102GF

NTS0102GF,115

XSON8

Reel 7" Q1 NDP

5000

–40 °C to +125 °C

NTS0102TL

NTS0102TLH

XSON8

Reel 7" Q3 NDP

3000

–40 °C to +125 °C

Table 2. Ordering options

[1]

Standard packing quantities and other packaging data are available at www.nxp.com/packages/.

[2]

Discontinuation Notice 202111012DN - drop in replacement is NTS0102TLH.

The TL package has a center pad vs no center pad for the GD package. The TL package pad is not electrically connected to the silicon and is not required

to connect to the PCB so it can drop onto the GD package PCB layout. If the existing GD package has a trace underneath the risk is low since the TL

package center pad is not connected to the silicon. If there are multiple traces there could be EMI and cross talk. In both cases the customer needs to

evaluate risk.

NTS0102

All information provided in this document is subject to legal disclaimers.

© NXP B.V. 2022. All rights reserved.

Product data sheet

Rev. 4.3 — 20 April 2022

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