7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

0

6

V

Signal input pins

Common mode voltage(2)

(V–) – 0.5

(V+) + 0.5

V

Differential voltage(3)

V

Current(2)

–10

10

mA

Output short-circuit(4)

Continuous

–55

150

°C

150

–65

150

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress

ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under

Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

(2)

Input pins are diode-clamped to the power-supply rails. Input signals that may swing more than 0.5 V beyond the supply rails must be

current limited to 10 mA or less

(3)

Differential input voltages greater than 0.5 V applied continuously can result in a shift to the input offset voltage above the maximum

specification of this parameter. The magnitude of this effect increases as the ambient operating temperature rises.

(4)

7.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±1000

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Single-supply

1.8

5.5

V

Dual-supply

±0.9

±2.75

Input Voltage Range

(V–)

(V+)

V

Specified temperature

Specified temperature

–40

125

°C

7.4 Thermal Information

THERMAL METRIC(1)

INA350ABS, INA350CDS

UNIT

DDF (SOT-23-

THN)

DSG (WSON)

RUG (X2QFN)

8 PINS

8 PINS

10 PINS

Junction-to-ambient thermal resistance

169.1

89.2

TBD

°C/W

Junction-to-case (top) thermal resistance

101.7

111.8

TBD

°C/W

Junction-to-board thermal resistance

84.8

55.8

TBD

°C/W

Junction-to-top characterization parameter

12.6

9.3

TBD

°C/W

Junction-to-board characterization parameter

84.3

55.7

TBD

°C/W

Junction-to-case (bottom) thermal resistance

n/a

31.0

TBD

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

INA350

SBOSAA0B – NOVEMBER 2021 – REVISED APRIL 2022

www.ti.com

6

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