ADuM6400/ADuM6401/ADuM6402/ADuM6403/ADuM6404

Data Sheet

Rev. B | Page 2 of 28

TABLE OF CONTENTS

Features .............................................................................................. 1

 

Applications ...................................................................................... 1

 

General Description ......................................................................... 1

 

Functional Block Diagrams............................................................. 1

 

Revision History ............................................................................... 2

 

Specifications .................................................................................... 3

 

Electrical Characteristics—5 V Primary Input Supply/5 V

Secondary Isolated Supply .......................................................... 3

 

Electrical Characteristics—3.3 V Primary Input Supply/3.3 V

Secondary Isolated Supply .......................................................... 5

 

Electrical Characteristics—5 V Primary Input Supply/3.3 V

Secondary Isolated Supply .......................................................... 6

 

Package Characteristics ............................................................... 8

 

Regulatory Information............................................................... 9

 

Insulation and Safety-Related Specifications ........................... 9

 

Insulation Characteristics ......................................................... 10

 

Recommended Operating Conditions .................................... 10

 

Absolute Maximum Ratings ......................................................... 11

 

ESD Caution................................................................................ 11

 

Pin Configurations and Function Descriptions......................... 12

 

Truth Table ................................................................................. 16

 

Typical Performance Characteristics .......................................... 17

 

Terminology.................................................................................... 20

 

Applications Information ............................................................. 21

 

PCB Layout ................................................................................. 21

 

Start-Up Behavior ...................................................................... 21

 

EMI Considerations................................................................... 22

 

Propagation Delay Parameters................................................. 22

 

DC Correctness and Magnetic Field Immunity .................... 22

 

Power Consumption.................................................................. 23

 

Current Limit and Thermal Overload Protection................. 24

 

Power Considerations ............................................................... 24

 

Thermal Analysis ....................................................................... 25

 

Insulation Lifetime..................................................................... 25

 

Outline Dimensions....................................................................... 26

 

Ordering Guide .......................................................................... 27

 

REVISION HISTORY

7/2020—Rev. A to Rev. B

Changes to Table 15 ......................................................................... 9

Changes to PCB Layout Section................................................... 21

Changes to Start-Up Behavior Section........................................ 22

Updated Outline Dimensions....................................................... 27

Changes to Ordering Guide.......................................................... 28

4/2012—Rev. 0 to Rev. A

Changes to Features Section, General Description Section,

and Table 1 ........................................................................................ 1

Changes to Table 2 and Table 3...................................................... 3

Changes to Endnote 1 in Table 5 ................................................... 4

Changes to Table 6 and Table 7...................................................... 5

Change to Propagation Delay Parameter in Table 8 ................... 5

Changes to Endnote 1 in Table 9; Changes to Table 10.............. 6

Changes to Table 11 ......................................................................... 7

Changes to Endnote 1 in Table 13; Changes to Table 14 ........... 8

Changes to Regulatory Information Section, Table 15,

and Table 16 ...................................................................................... 9

Changes to Insulation Characteristics Section, Table 17,

and Table 18 .................................................................................... 10

Changes to Table 20....................................................................... 11

Changes to Table 26....................................................................... 16

Changes to Figure 13, Figure 14, Figure 15, Figure 17,

and Figure 18 .................................................................................. 17

Changes to Figure 19 and Figure 20 ............................................ 18

Added Figure 21 and Figure 22; Renumbered

Figures Sequentially ....................................................................... 18

Changes to PCB Layout Section................................................... 21

Added Start-Up Behavior Section................................................ 21

Changes to EMI Considerations Section .................................... 22

Moved Propagation Delay Parameters Section ......................... 22

Changes to Power Consumption Section ................................... 23

Added Current Limit and Thermal Overload Protection

Section.............................................................................................. 24

Moved Thermal Analysis Section ................................................ 25

Changes to Insulation Lifetime Section and Figure 33............. 25

Updated Outline Dimensions ...................................................... 26

Changes to Ordering Guide.......................................................... 27

5/2009—Revision 0: Initial Version