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MD1813 Datasheet(PDF) 5 Page - Supertex, Inc

Part # MD1813
Description  High Speed Quad MOSFET Driver
PDF  6 Pages
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Manufacturer  SUTEX [Supertex, Inc]
Direct Link  http://www.supertex.com
Logo SUTEX - Supertex, Inc

MD1813 Datasheet(HTML) 5 Page - Supertex, Inc

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5
NR031706
MD1813
Application Information
For proper operation of the MD1813, low inductance bypass
capacitors should be used on the various supply pins. The GND
pin should be connected to the logic ground. The IN
A, INB, INC, IND
and OE pins should be connected to a logic source with a swing
of GND to V
CC, where VCC is 1.2 to 5.0 volts. Good trace practices
should be followed corresponding to the desired operating speed.
The internal circuitry of the MD1813 is capable of operating up
to 100MHz, with the primary speed limitation being the loading
effects of the load capacitance. Because of this speed and the
high transient currents that result with capacitive loads, the bypass
capacitors should be as close to the chip pins as possible. Unless
the load specifically requires bipolar drive, the V
SS, and VL pins
should have low inductance feed-through connections directly to a
ground plane. If these voltages are not zero, then they need bypass
capacitors in a manner similar to the positive power supplies. The
power connections V
DD should have a ceramic bypass capacitor to
the ground plane with short leads and decoupling components to
prevent resonance in the power leads.
Output drivers, OUT
A and OUTC, drive the gate of an external P-
channel MOSFET, while output drivers OUT
B and OUTD drive the
gate of an external N-channel MOSFET, and they all swing from
V
H to VL. The auxiliary output drive, OUTG, swings from VSS to VNEG,
and drives the external P-channel MOSFET as negative bias via a
2KΩ series resistor.
The voltages of V
H and VL decide the output signal levels. These
two pins can draw fast transient currents of up to 2A, so they
should be provided with an appropriate bypass capacitor located
next to the chip pins. A ceramic capacitor of up to 1.0µF may be
appropriate, with a series ferrite bead to prevent resonance in the
power supply lead coming to the capacitor. Pay particular attention
to minimizing trace lengths, current loop area, and using sufficient
trace width to reduce inductance. Surface mount components are
highly recommended. Since the output impedance of this driver is
very low, in some cases it may be desirable to add a small series
resistance in series with the output signal to obtain better waveform
transitions at the load terminals. This will of course reduce the
output voltage slew rate at the terminals of a capacitive load.
The OE pin sets the threshold level of logic for inputs (V
OE + VGND) /
2. When OE is low, OUT
A is at VH. OUTB is at VL, regardless of the
inputs IN
A or INB. This pin will not control OUTC, OUTD, or OUTG.
Pay particular attention that parasitic couplings are minimized from
the output to the input signal terminals. The parasitic feedback may
cause oscillations or spurious waveform shapes on the edges of
signal transitions. Since the input operates with signals down to
1.2V, even small coupled voltages may cause problems. Use of
a solid ground plane and good power and signal layout practices
will prevent this problem. Be careful that a circulating ground
return current from a capacitive load cannot react with common
inductance to cause noise voltages in the input logic circuitry. Best
timing performance is obtained for OUT
C when the voltage of (VSS-
V
NEG) = (VH-VL).
When input logic is high, output will swing to V
L, and when input
logic is low, output will swing to V
H. All inputs must be kept low until
the device is powered up.



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