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MD1813 Datasheet(PDF) 5 Page - Supertex, Inc |
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MD1813 Datasheet(HTML) 5 Page - Supertex, Inc |
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5 / 6 page ![]() 5 NR031706 MD1813 Application Information For proper operation of the MD1813, low inductance bypass capacitors should be used on the various supply pins. The GND pin should be connected to the logic ground. The IN A, INB, INC, IND and OE pins should be connected to a logic source with a swing of GND to V CC, where VCC is 1.2 to 5.0 volts. Good trace practices should be followed corresponding to the desired operating speed. The internal circuitry of the MD1813 is capable of operating up to 100MHz, with the primary speed limitation being the loading effects of the load capacitance. Because of this speed and the high transient currents that result with capacitive loads, the bypass capacitors should be as close to the chip pins as possible. Unless the load specifically requires bipolar drive, the V SS, and VL pins should have low inductance feed-through connections directly to a ground plane. If these voltages are not zero, then they need bypass capacitors in a manner similar to the positive power supplies. The power connections V DD should have a ceramic bypass capacitor to the ground plane with short leads and decoupling components to prevent resonance in the power leads. Output drivers, OUT A and OUTC, drive the gate of an external P- channel MOSFET, while output drivers OUT B and OUTD drive the gate of an external N-channel MOSFET, and they all swing from V H to VL. The auxiliary output drive, OUTG, swings from VSS to VNEG, and drives the external P-channel MOSFET as negative bias via a 2KΩ series resistor. The voltages of V H and VL decide the output signal levels. These two pins can draw fast transient currents of up to 2A, so they should be provided with an appropriate bypass capacitor located next to the chip pins. A ceramic capacitor of up to 1.0µF may be appropriate, with a series ferrite bead to prevent resonance in the power supply lead coming to the capacitor. Pay particular attention to minimizing trace lengths, current loop area, and using sufficient trace width to reduce inductance. Surface mount components are highly recommended. Since the output impedance of this driver is very low, in some cases it may be desirable to add a small series resistance in series with the output signal to obtain better waveform transitions at the load terminals. This will of course reduce the output voltage slew rate at the terminals of a capacitive load. The OE pin sets the threshold level of logic for inputs (V OE + VGND) / 2. When OE is low, OUT A is at VH. OUTB is at VL, regardless of the inputs IN A or INB. This pin will not control OUTC, OUTD, or OUTG. Pay particular attention that parasitic couplings are minimized from the output to the input signal terminals. The parasitic feedback may cause oscillations or spurious waveform shapes on the edges of signal transitions. Since the input operates with signals down to 1.2V, even small coupled voltages may cause problems. Use of a solid ground plane and good power and signal layout practices will prevent this problem. Be careful that a circulating ground return current from a capacitive load cannot react with common inductance to cause noise voltages in the input logic circuitry. Best timing performance is obtained for OUT C when the voltage of (VSS- V NEG) = (VH-VL). When input logic is high, output will swing to V L, and when input logic is low, output will swing to V H. All inputs must be kept low until the device is powered up. |
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